DOI: 10.1016/s0924-4247(00)00350-2. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength

Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength

10.1016/s0924-4247(00)00350-2

Crossref journal-article

Elsevier BV

Sensors and Actuators A: Physical (78)

Bibliography

Yi, T., Li, L., & Kim, C.-J. (2000). Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength. Sensors and Actuators A: Physical, 83(1â3), 172â178.

Authors 3

Taechung Yi (first)
Lu Li (additional)
Chang-Jin Kim (additional)

References 11 Referenced 165

{'key': '10.1016/S0924-4247(00)00350-2_BIB1', 'series-title': 'Mechanical Metallurgy', 'author': 'Dieter', 'year': '1986'} / Mechanical Metallurgy by Dieter (1986)
10.1063/1.1721449 / J. Appl. Phys. / Measurement of elastic constants at low temperatures by means of ultrasonic waves — data for silicon and germanium single crystals, and for fused silica by McSkimin (1953)
10.1103/PhysRev.133.A1604 / Phys. Rev. / Third-order elastic constants and the velocity of small amplitude elastic waves in homogeneously stressed media by Thurston (1964)
10.1103/PhysRev.161.756 / Phys. Rev. / Electronic effects in the elastic constants of n-type silicon by Hall (1967)
ASTM Standard C 623-92, Standard Test Method for Young's Modulus, Shear Modulus, and Poisson's Ratio for Glass and Glass–Ceramic by Resonance, Annual Book of ASTM Standards.
10.1063/1.1661935 / J. Appl. Phys. / Calculated elastic constants for stress problems associated with semiconductor devices by Brantley (1973)
10.1109/84.623107 / J. Microelectromech. Syst. / A new technique for measuring the mechanical properties of thin films by Sharpe (1997)
{'key': '10.1016/S0924-4247(00)00350-2_BIB8', 'first-page': '595', 'article-title': 'Micro tensile-test of silicon film having different crystallographic orientations', 'author': 'Sato', 'year': '1996'} / Micro tensile-test of silicon film having different crystallographic orientations by Sato (1996)
10.1557/JMR.1998.0454 / J. Mater. Res. / Microinstruments for submicron material studies by Saif (1998)
10.1109/84.536620 / J. Microelectromech. Syst. / Fracture testing of bulk silicon microcantilever beam subjected to a side load by Wilson (1996)
L.-S. Huang, Silicon Bulk Micromachining in MEMS Packaging and Optical Applications, PhD Dissertation, Mechanical and Aerospace Engineering Department, University of California, Los Angeles, 1999.

Dates

Type	When
Created	23 years, 1 month ago (July 25, 2002, 6:34 p.m.)
Deposited	6 years, 4 months ago (April 14, 2019, 4:56 a.m.)
Indexed	2 months, 1 week ago (June 26, 2025, 12:48 a.m.)
Issued	25 years, 4 months ago (May 1, 2000)
Published	25 years, 4 months ago (May 1, 2000)
Published Print	25 years, 4 months ago (May 1, 2000)

Funders 0

None

BibTeX

@article{Yi_2000, title={Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength}, volume={83}, ISSN={0924-4247}, url={http://dx.doi.org/10.1016/s0924-4247(00)00350-2}, DOI={10.1016/s0924-4247(00)00350-2}, number={1–3}, journal={Sensors and Actuators A: Physical}, publisher={Elsevier BV}, author={Yi, Taechung and Li, Lu and Kim, Chang-Jin}, year={2000}, month=may, pages={172–178} }

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