Crossref
journal-article
Elsevier BV
Materials Science and Engineering: A (78)
References
25
Referenced
36
{'key': '10.1016/S0921-5093(01)01936-0_BIB1', 'series-title': 'Electronic Packaging Materials and Their Properties', 'first-page': '3', 'author': 'Pecht', 'year': '1999'}
/ Electronic Packaging Materials and Their Properties by Pecht (1999){'key': '10.1016/S0921-5093(01)01936-0_BIB2', 'series-title': 'Electronic Materials Chemistry', 'first-page': '461', 'author': 'Perry', 'year': '1996'}
/ Electronic Materials Chemistry by Perry (1996)-
F. Boey, L. Cao, K.A. Khor, A.I.Y. Tok, Acta Materialia 49 (2001) pp. 3117–3127.
(
10.1016/S1359-6454(00)00391-8
) - F. Boey, A.I.Y. Tok, W.J. Clegg, J. Mater. Res. (2001) in press.
- F. Boey, A.I.Y. Tok, H.Y. Yeong, Y. Long, J. Mater. Res. (2002) in press.
- F. Boey, A.I.Y. Tok, S.P. Ng, Mater. Sci. Eng. A (2002) submitted.
10.1016/S0921-5093(00)01658-0
/ Mater. Sci. Eng. A by Khor (2001)10.1016/0955-2219(93)90102-W
/ J. Eur. Ceram. Soc. by Buhr (1993)10.1016/0955-2219(91)90087-G
/ J. Eur. Ceram. Soc. by Thomas (1991)10.1007/BF00540680
/ J. Mater. Sci. by Watari (1992)10.1111/j.1151-2916.1997.tb03000.x
/ J. Am. Ceram. Soc. by Virkar (1997){'key': '10.1016/S0921-5093(01)01936-0_BIB12', 'first-page': '553', 'volume': '122–124', 'author': 'Baik', 'year': '1996'}
by Baik (1996)10.1016/0955-2219(91)90112-D
/ J. Eur. Ceram. Soc. by Ruckmich (1991)10.1016/0022-3697(87)90153-3
/ J. Phys. Solids by Slack (1987){'key': '10.1016/S0921-5093(01)01936-0_BIB15', 'series-title': 'Introduction to Ceramics', 'author': 'Kingery', 'year': '1991'}
/ Introduction to Ceramics by Kingery (1991)10.1007/BF00540680
/ J. Mater. Sci. by Watari (1992)10.1111/j.1151-2916.1996.tb08083.x
/ J. Am. Ceram. Soc. by Watari (1996)10.1111/j.1151-2916.1996.tb08549.x
/ J. Am. Ceram. Soc. by Kim (1996)10.1111/j.1151-2916.1991.tb06914.x
/ J. Am. Ceram. Soc. by Buhr (1991)10.1111/j.1151-2916.1991.tb08287.x
/ J. Am. Ceram. Soc. by Enloe (1991)10.1016/S0921-5093(99)00691-7
/ Mater. Sci. Eng. A by Tok (2000)10.1016/S0924-0136(99)00131-4
/ J. Mater. Processing Technol. by Tok (1999)- S.C. Joshi, Y.C. Lam, F.Y.C. Boey, A.I.Y. Tok, J. Mater. Processing Technol., (2001) in press.
- ASTM E 1461-92, 1998 Annual Book of ASTM Standards, Vol. 14.02, (1998) pp.878–885.
10.1111/j.1151-2916.1999.tb02209.x
/ J. Am. Ceram. Soc. by Kitayama (1999)
Dates
Type | When |
---|---|
Created | 22 years, 10 months ago (Oct. 14, 2002, 4:48 p.m.) |
Deposited | 1 year, 7 months ago (Dec. 30, 2023, 12:45 p.m.) |
Indexed | 1 month, 2 weeks ago (July 14, 2025, 11:16 p.m.) |
Issued | 22 years, 11 months ago (Sept. 1, 2002) |
Published | 22 years, 11 months ago (Sept. 1, 2002) |
Published Print | 22 years, 11 months ago (Sept. 1, 2002) |
@article{Boey_2002, title={On the effects of secondary phase on thermal conductivity of AlN ceramic substrates using a microstructural modeling approach}, volume={335}, ISSN={0921-5093}, url={http://dx.doi.org/10.1016/s0921-5093(01)01936-0}, DOI={10.1016/s0921-5093(01)01936-0}, number={1–2}, journal={Materials Science and Engineering: A}, publisher={Elsevier BV}, author={Boey, F and Tok, A.I.Y and Lam, Y.C and Chew, S.Y}, year={2002}, month=sep, pages={281–289} }