DOI: 10.1016/s0167-9317(02)00885-7. Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique

Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique

10.1016/s0167-9317(02)00885-7

Crossref journal-article

Elsevier BV

Microelectronic Engineering (78)

Bibliography

Fang, T.-H., & Chang, W.-J. (2003). Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique. Microelectronic Engineering, 65(1â2), 231â238.

Authors 2

Te-Hua Fang (first)
Win-Jin Chang (additional)

References 15 Referenced 93

10.1080/01418618308234914 / Phil. Mag. A by Pethica (1983)
{'key': '10.1016/S0167-9317(02)00885-7_BIB2', 'series-title': 'Handbook of Micro/Nano Tribology', 'author': 'Bhushan', 'year': '1995'} / Handbook of Micro/Nano Tribology by Bhushan (1995)
{'key': '10.1016/S0167-9317(02)00885-7_BIB3', 'series-title': 'Fundamentals of Nanoindentation and Nanotribology', 'author': 'Moody', 'year': '1998'} / Fundamentals of Nanoindentation and Nanotribology by Moody (1998)
10.1016/0040-6090(94)06357-5 / Thin Solid Films by Sun (1995)
10.1016/0040-6090(95)06839-2 / Thin Solid Films by Wittling (1995)
10.1016/0921-5093(95)09927-1 / Mater. Sci. Eng. by Fougere (1995)
10.1016/S0955-2219(98)00083-1 / J. Eur. Ceram. Soc. by Woirgard (1998)
10.1016/S0040-6090(00)01907-6 / Thin Solid Films by Ohmura (2001)
10.1016/S0257-8972(01)00987-2 / Surf. Coat. Tech. by Chen (2001)
10.1088/0957-4484/11/3/308 / Nanotechnology by Fang (2000)
10.1016/S0167-577X(96)00160-7 / Mater. Lett. by Kulkarni (1996)
10.1016/0956-7151(94)00291-O / Acta Metall. Mater. by Armstrong (1995)
10.1016/S1044-5803(00)00072-3 / Mater. Charact. by Tsang (2000)
10.1016/S1359-6454(00)00009-4 / Acta Mater. by Gouldstone (2000)
10.1016/S1359-6454(97)00092-X / Acta Mater. by Sanders (1997)

Dates

Type	When
Created	22 years, 9 months ago (Nov. 11, 2002, 11:13 a.m.)
Deposited	6 years, 4 months ago (April 9, 2019, 3:27 a.m.)
Indexed	1 month, 1 week ago (July 27, 2025, 3:13 a.m.)
Issued	22 years, 8 months ago (Jan. 1, 2003)
Published	22 years, 8 months ago (Jan. 1, 2003)
Published Print	22 years, 8 months ago (Jan. 1, 2003)

Funders 0

None

BibTeX

@article{Fang_2003, title={Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique}, volume={65}, ISSN={0167-9317}, url={http://dx.doi.org/10.1016/s0167-9317(02)00885-7}, DOI={10.1016/s0167-9317(02)00885-7}, number={1–2}, journal={Microelectronic Engineering}, publisher={Elsevier BV}, author={Fang, Te-Hua and Chang, Win-Jin}, year={2003}, month=jan, pages={231–238} }

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