DOI: 10.1016/s0141-6359(00)00072-6. Extreme negative rake angle technique for single point diamond nano-cutting of silicon

Extreme negative rake angle technique for single point diamond nano-cutting of silicon

10.1016/s0141-6359(00)00072-6

Crossref journal-article

Elsevier BV

Precision Engineering (78)

Bibliography

Patten, J. A., & Gao, W. (2001). Extreme negative rake angle technique for single point diamond nano-cutting of silicon. Precision Engineering, 25(2), 165â167.

Authors 2

John A Patten (first)
Wei Gao (additional)

References 7 Referenced 37

10.1016/S0007-8506(07)62782-6 / Annals of the CIRP / Diamond cutting of silicon with nanometric finish by Fang (1998)
Lovingood John. Nanocut II. MS Thesis, UNC Charlotte, 1998.
10.1016/S0007-8506(07)62878-9 / Annals of the CIRP / Effect of tool edge geometry on the nanometric cutting of Ge by Lucca (1998)
Patten JA. Cutting tool edge radius, and depth of cut influence on the generation of the high pressure phase transformation during ductile machining. Proceedings ASPE Spring Topical Meeting on Silicon Machining. April, 1998. p. 88–91.
Patten JA. High pressure phase transformation analysis, and molecular dynamics simulation of single point diamond turning of germanium. Ph.D. dissertation, NCSU, 1996.
Suzuki K, Hu Bing Qun, Iwai M, Ichinose M, Uematsu T. Grinding performance in repeated reversal of grind wheel direction during grinding cycle. Advances in Abrasive Technology III. N. Yasunaga, J. Tamaki, K. Suzuki, and T. Uematsu, eds. The Society of Grinding Engineers, Tokyo, Japan, 2000, p. 521.
Yan Jiwang, et al. Brittle -Ductile transition behavior in diamond turning of single crystal silicon using straight nosed tools. Proceedings ASPE 1998 Annual Meeting, Vol. 18, p. 128–131.

Dates

Type	When
Created	23 years ago (July 25, 2002, 12:48 p.m.)
Deposited	6 years, 4 months ago (April 20, 2019, 6:51 p.m.)
Indexed	1 week, 4 days ago (Aug. 12, 2025, 5:39 p.m.)
Issued	24 years, 4 months ago (April 1, 2001)
Published	24 years, 4 months ago (April 1, 2001)
Published Print	24 years, 4 months ago (April 1, 2001)

Funders 0

None

BibTeX

@article{Patten_2001, title={Extreme negative rake angle technique for single point diamond nano-cutting of silicon}, volume={25}, ISSN={0141-6359}, url={http://dx.doi.org/10.1016/s0141-6359(00)00072-6}, DOI={10.1016/s0141-6359(00)00072-6}, number={2}, journal={Precision Engineering}, publisher={Elsevier BV}, author={Patten, John A and Gao, Wei}, year={2001}, month=apr, pages={165–167} }

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