DOI: 10.1016/s0040-6090(97)00387-8. Residual stress in silicon films deposited by LPCVD from disilane

Residual stress in silicon films deposited by LPCVD from disilane

10.1016/s0040-6090(97)00387-8

Crossref journal-article

Elsevier BV

Thin Solid Films (78)

Bibliography

Temple-Boyer, P., Scheid, E., Faugere, G., & Rousset, B. (1997). Residual stress in silicon films deposited by LPCVD from disilane. Thin Solid Films, 310(1â2), 234â237.

Authors 4

P. Temple-Boyer (first)
E. Scheid (additional)
G. Faugere (additional)
B. Rousset (additional)

References 8 Referenced 16

10.1016/0040-6090(88)90689-X / Thin Solid Films by Koleshko (1988)
{'key': '10.1016/S0040-6090(97)00387-8_bib2', 'first-page': '85', 'volume': '276', 'author': 'Oei', 'year': '1992'} by Oei (1992)
10.1016/0924-4247(93)80122-W / Sensors and Actuators by Benitez (1993)
10.1088/0960-1317/5/2/016 / J. Micromech. Microeng. by Maier-Schneider (1995)
{'key': '10.1016/S0040-6090(97)00387-8_bib5', 'first-page': '172', 'volume': '9', 'author': 'Stoney', 'year': '1909'} by Stoney (1909)
10.1143/JJAP.29.L2105 / Jpn. J. Appl. Phys. by Scheid (1990)
10.1063/1.347215 / J. Appl. Phys. by Nakazawa (1991)
10.1016/0921-5107(93)90082-X / Mater. Sci. Eng. B by Scheid (1993)

Dates

Type	When
Created	23 years, 1 month ago (July 25, 2002, 9:06 p.m.)
Deposited	6 years, 4 months ago (April 16, 2019, 12:24 a.m.)
Indexed	1 year ago (Aug. 10, 2024, 7:36 p.m.)
Issued	27 years, 10 months ago (Nov. 1, 1997)
Published	27 years, 10 months ago (Nov. 1, 1997)
Published Print	27 years, 10 months ago (Nov. 1, 1997)

Funders 0

None

BibTeX

@article{Temple_Boyer_1997, title={Residual stress in silicon films deposited by LPCVD from disilane}, volume={310}, ISSN={0040-6090}, url={http://dx.doi.org/10.1016/s0040-6090(97)00387-8}, DOI={10.1016/s0040-6090(97)00387-8}, number={1–2}, journal={Thin Solid Films}, publisher={Elsevier BV}, author={Temple-Boyer, P. and Scheid, E. and Faugere, G. and Rousset, B.}, year={1997}, month=nov, pages={234–237} }

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