DOI: 10.1016/s0040-6090(01)01372-4. Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films

Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films

10.1016/s0040-6090(01)01372-4

Crossref journal-article

Elsevier BV

Thin Solid Films (78)

Bibliography

Kim, K. J., Lee, N.-E., Kim, M. C., & Boo, J.-H. (2001). Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films. Thin Solid Films, 398â399, 657â662.

Authors 4

K.J. Kim (first)
N.-E. Lee (additional)
M.C. Kim (additional)
J.-H. Boo (additional)

References 15 Referenced 18

10.1016/0040-6090(95)05813-3 / Thin Solid Films by Mouche (1995)
{'key': '10.1016/S0040-6090(01)01372-4_BIB2', 'first-page': '105', 'volume': '39', 'author': 'Bohr', 'year': '1996', 'journal-title': 'Solid State Technol.'} / Solid State Technol. by Bohr (1996)
10.1080/10408439508243732 / Rev. Solid State Mater. Sci. by Murarka (1995)
J.S.H. Cho, H.-K. Kang, C. Ryu, S.S. Wong, Proc. IEDM Tech. Dig., (1993) 265.
10.1109/55.545766 / IEEE Electron Device Lett. by Loke (1996)
10.1143/JJAP.38.1356 / Jpn. J. Appl. Phys. by Quan (1999)
10.1063/1.371119 / J. Appl. Phys. by Endo (1999)
{'key': '10.1016/S0040-6090(01)01372-4_BIB8', 'first-page': '64', 'volume': '21', 'author': 'Peters', 'year': '1998', 'journal-title': 'Semicond. Int.'} / Semicond. Int. by Peters (1998)
10.1016/S0040-6090(00)01422-X / Thin Solid Films by Kim (2000)
10.1116/1.1340658 / J. Vac. Sci. Technol. by Kim (2001)
J.F. Moulder, W.F. Strickle, P.E. Sobol, K.D. Bomben, Handbook of X-Ray Photoelectron Spectroscopy, Prekin-Elmer Corporation, 1992, p. 41.
10.1016/S0927-7757(00)00454-4 / Colloids Surf. A by Shen (2000)
10.1063/1.363999 / J. Appl. Phys. by Chang (1997)
10.1002/(SICI)1096-9918(199907)27:7<609::AID-SIA523>3.0.CO;2-# / Surf. Interface Anal. by Wolany (1999)
10.1063/1.369279 / J. Appl. Phys. by Du (1999)

Dates

Type	When
Created	23 years, 1 month ago (July 25, 2002, 1:58 a.m.)
Deposited	6 years, 4 months ago (May 3, 2019, 5:29 a.m.)
Indexed	1 month, 3 weeks ago (July 9, 2025, 6:52 p.m.)
Issued	23 years, 10 months ago (Nov. 1, 2001)
Published	23 years, 10 months ago (Nov. 1, 2001)
Published Print	23 years, 10 months ago (Nov. 1, 2001)

Funders 0

None

BibTeX

@article{Kim_2001, title={Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films}, volume={398–399}, ISSN={0040-6090}, url={http://dx.doi.org/10.1016/s0040-6090(01)01372-4}, DOI={10.1016/s0040-6090(01)01372-4}, journal={Thin Solid Films}, publisher={Elsevier BV}, author={Kim, K.J. and Lee, N.-E. and Kim, M.C. and Boo, J.-H.}, year={2001}, month=nov, pages={657–662} }

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