Crossref journal-article
Elsevier BV
Scripta Metallurgica et Materialia (78)
Bibliography

Wang, X. H., & Conrad, H. (1994). Effect of Sn content of Pb-Sn solder alloys on wetting dynamics. Scripta Metallurgica et Materialia, 31(4), 375–380.

Authors 2
  1. Xiao Hong Wang (first)
  2. Hans Conrad (additional)
References 7 Referenced 12
  1. {'key': '10.1016/0956-716X(94)90003-5_BIB1', 'series-title': 'Materials Developments in Microelectronics Packaging: Performance and Reliability', 'first-page': '61', 'author': 'Chen', 'year': '1991'} / Materials Developments in Microelectronics Packaging: Performance and Reliability by Chen (1991)
  2. 10.1016/0956-716X(94)90189-9 / Scripta Metall. Mater. by Wang (1994)
  3. X. H. Wang and H. Conrad, “Kinetics of Wetting Metal Substrates by Molten 60Sn40Pb”, submitted to Met. Trans. A.
  4. {'key': '10.1016/0956-716X(94)90003-5_BIB4', 'first-page': '57', 'volume': '80', 'author': 'Bailey', 'year': '1951', 'journal-title': 'J. Inst. Met.'} / J. Inst. Met. by Bailey (1951)
  5. 10.2320/jinstmet1952.45.8_847 / J. Jap. Inst. Met. by Kawakatsu (1981)
  6. 10.1080/14786442608564064 / Phil. Mag. by Biscumshaw (1926)
  7. 10.1080/14786443409462379 / Phil. Mag. by Biscumshaw (1934)
Dates
Type When
Created 22 years, 2 months ago (June 21, 2003, 8:29 a.m.)
Deposited 6 years, 5 months ago (March 18, 2019, 10:23 p.m.)
Indexed 1 year, 6 months ago (Feb. 7, 2024, 3:36 a.m.)
Issued 31 years ago (Aug. 1, 1994)
Published 31 years ago (Aug. 1, 1994)
Published Print 31 years ago (Aug. 1, 1994)
Funders 0

None

@article{Wang_1994, title={Effect of Sn content of Pb-Sn solder alloys on wetting dynamics}, volume={31}, ISSN={0956-716X}, url={http://dx.doi.org/10.1016/0956-716x(94)90003-5}, DOI={10.1016/0956-716x(94)90003-5}, number={4}, journal={Scripta Metallurgica et Materialia}, publisher={Elsevier BV}, author={Wang, Xiao Hong and Conrad, Hans}, year={1994}, month=aug, pages={375–380} }