DOI: 10.1007/s11837-006-0186-6. The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

10.1007/s11837-006-0186-6

Crossref journal-article

Springer Science and Business Media LLC

JOM (297)

Bibliography

Deppisch, C., Fitzgerald, T., Raman, A., Hua, F., Zhang, C., Liu, P., & Miller, M. (2006). The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging. JOM, 58(6), 67â74.

Authors 7

Carl Deppisch (first)
Thomas Fitzgerald (additional)
Arun Raman (additional)
Fay Hua (additional)
Charles Zhang (additional)
Pilin Liu (additional)
Mikel Miller (additional)

References 9 Referenced 74

P. Brandenburger et al., IATTJ, 3 (2000), pp. 331–343. / IATTJ by P. Brandenburger (2000)
A. Dani et al., IATTJ, 4 (2001), pp. 265–277. / IATTJ by A. Dani (2001)
F. Hua and C. Deppisch, Journal of Surface Mount Technology, 19 (2006), pp. 21–26. / Journal of Surface Mount Technology by F. Hua (2006)
F.S. Shieu et al., Thin Solid Films, 346 (1999), pp. 125–129. (10.1016/S0040-6090(98)01737-4) / Thin Solid Films by F.S. Shieu (1999)
D.R. Frear and F.G. Yost, MRS Bulletin, December (1993), pp. 49–54.
W.J. Plumbridge, Journal of Materials Science, 31 (1996), pp. 2501–2514. (10.1007/BF00687275) / Journal of Materials Science by W.J. Plumbridge (1996)
C.L. Deppisch et al., “Electronic Assembly Having a Wetting Layer on a Thermally Conductive Heat Spreader,” U.S. patent 6,504,242 (7 January 2003).
Y.M. Liu and T.H. Chuang, Journal of Electronic Materials, 29 (2000), pp. 405–410. (10.1007/s11664-000-0152-y) / Journal of Electronic Materials by Y.M. Liu (2000)
M. Hansen, Constitution of Binary Alloys, 2nd edition (New York, NY: McGraw-Hill Co., 1958). / Constitution of Binary Alloys by M. Hansen (1958)

Dates

Type	When
Created	18 years, 1 month ago (June 27, 2007, 4:34 a.m.)
Deposited	6 years, 2 months ago (June 1, 2019, 6:53 p.m.)
Indexed	1 day, 19 hours ago (Aug. 19, 2025, 6:43 a.m.)
Issued	19 years, 2 months ago (June 1, 2006)
Published	19 years, 2 months ago (June 1, 2006)
Published Print	19 years, 2 months ago (June 1, 2006)

Funders 0

None

BibTeX

@article{Deppisch_2006, title={The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging}, volume={58}, ISSN={1543-1851}, url={http://dx.doi.org/10.1007/s11837-006-0186-6}, DOI={10.1007/s11837-006-0186-6}, number={6}, journal={JOM}, publisher={Springer Science and Business Media LLC}, author={Deppisch, Carl and Fitzgerald, Thomas and Raman, Arun and Hua, Fay and Zhang, Charles and Liu, Pilin and Miller, Mikel}, year={2006}, month=jun, pages={67–74} }

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