DOI: 10.1007/s11664-998-0111-6. Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

10.1007/s11664-998-0111-6

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Kariya, Y., & Otsuka, M. (1998). Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy. Journal of Electronic Materials, 27(7), 866â870.

Authors 2

Yoshiharu Kariya (first)
Masahisa Otsuka (additional)

References 16 Referenced 88

D.P. Napp, SAMPE J. 32, 59 (1996). / SAMPE J. by D.P. Napp (1996)
John H. Lau, Solder Joint Reliability, (New York: Van Norstrand Reinohold, 1991), p. 572. (10.1007/978-1-4615-3910-0) / Solder Joint Reliability by John H. Lau (1991)
M. Harada and R. Satoh, IEEE Trans. Comp. Hybrids and Manuf. Technol. 13, 736 (1986). (10.1109/33.62587) / IEEE Trans. Comp. Hybrids and Manuf. Technol. by M. Harada (1986)
D.M. Jarboe, Thermal Fatigue Evaluation of Solder Alloys, Bendix Kansas City Division internal report, DBX-613-2341 (1980). (10.2172/5563721)
H.D. Solomon, Trans. ASME. J. Elec. Packaging 113, 102 (1991). (10.1115/1.2905374) / Trans. ASME. J. Elec. Packaging by H.D. Solomon (1991)
P.T. Vianco and A.C. Claghorn, Soldering & Surf. Mount Technol. 12, 12 (1996). (10.1108/09540919610777708) / Soldering & Surf. Mount Technol. by P.T. Vianco (1996)
M.E. Loomans, S. Vaynman, G. Ghosh and M.E. Fine, J. Electron. Mater. 23, 741 (1994). (10.1007/BF02651368) / J. Electron. Mater. by M.E. Loomans (1994)
U.R. Kattner and W.J. Boettinger, J. Electron. Mater. 23, 603 (1994). (10.1007/BF02653345) / J. Electron. Mater. by U.R. Kattner (1994)
M. McCormack and S. Jin, J. Electron. Mater. 23, 631 (1994). / J. Electron. Mater. by M. McCormack (1994)
M. McCormack and S. Jin, J. Electron. Mater. 23, 715 (1994). (10.1007/BF02651364) / J. Electron. Mater. by M. McCormack (1994)
M.E. Loomans, S. Vaynman, G. Ghosh, and M.E. Fine, J. Electron. Mater. 23, 741 (1994). (10.1007/BF02651368) / J. Electron. Mater. by M.E. Loomans (1994)
H.D. Solomon, IEEE Trans. Comp. Hybrids and Manuf. Technol., CHMT9, 423 (1986). (10.1109/TCHMT.1986.1136672)
S. Vaynman, M.E. Fine and D.A. Jeannotte, Metall. Trans. A, 19A, 1051 (1988). (10.1007/BF02628389) / Metall. Trans. A by S. Vaynman (1988)
E.C. Cutiongco, S. Vaynman, M.E. Fine and D.A. Jeannotte, Trans. ASME. J. Electron. Packaging 112, 110 (1990). (10.1115/1.2904350) / Trans. ASME. J. Electron. Packaging by E.C. Cutiongco (1990)
H.D. Solomom, Trans. ASME. J. Electronic Packaging 113, 102 (1991). (10.1115/1.2905374) / Trans. ASME. J. Electronic Packaging by H.D. Solomom (1991)
D.R. Frear, JOM 48, 49 (1996). (10.1007/BF03222944) / JOM by D.R. Frear (1996)

Dates

Type	When
Created	18 years, 4 months ago (April 6, 2007, 3:40 a.m.)
Deposited	6 years, 3 months ago (June 1, 2019, 12:04 p.m.)
Indexed	2 months, 1 week ago (June 26, 2025, 9:34 p.m.)
Issued	27 years, 2 months ago (July 1, 1998)
Published	27 years, 2 months ago (July 1, 1998)
Published Print	27 years, 2 months ago (July 1, 1998)

Funders 0

None

BibTeX

@article{Kariya_1998, title={Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy}, volume={27}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/s11664-998-0111-6}, DOI={10.1007/s11664-998-0111-6}, number={7}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Kariya, Yoshiharu and Otsuka, Masahisa}, year={1998}, month=jul, pages={866–870} }

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