DOI: 10.1007/s11664-998-0074-7. Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

10.1007/s11664-998-0074-7

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Kariya, Y., & Otsuka, M. (1998). Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys. Journal of Electronic Materials, 27(11), 1229â1235.

Authors 2

Yoshiharu Kariya (first)
Masahisa Otsuka (additional)

References 14 Referenced 147

D.P. Napp, SAMPE J. 32, 59 (1996). / SAMPE J. by D.P. Napp (1996)
P.T. Vianco and A.C. Claghorn, Soldering and Surf. Mount Technol. 12, 12 (1996). (10.1108/09540919610777708) / Soldering and Surf. Mount Technol. by P.T. Vianco (1996)
M. McCormack and S. Jin, J. Electron. Mater. 23, 715 (1994). (10.1007/BF02651364) / J. Electron. Mater. by M. McCormack (1994)
M.E. Loomans, S. Vaynman, G. Ghosh and M.E. Fine, J. Electron. Mater. 23, 741 (1994). (10.1007/BF02651368) / J. Electron. Mater. by M.E. Loomans (1994)
C.M. Miller, I.E. Anderson and J.F. Smith, J. Electron. Mater. 23, 595 (1994). (10.1007/BF02653344) / J. Electron. Mater. by C.M. Miller (1994)
U.R. Kattner and W.J. Boettinger, J. Electron. Mater. 23, 603 (1994). (10.1007/BF02653345) / J. Electron. Mater. by U.R. Kattner (1994)
M. McCormack and S. Jin, J. Electron. Mater. 23, 635 (1994). (10.1007/BF02653349) / J. Electron. Mater. by M. McCormack (1994)
M. McCormack, S. Jin and D.A. Machusak, J. Electron. Mater. 23, 687 (1994). (10.1007/BF02653357) / J. Electron. Mater. by M. McCormack (1994)
D.M. Jarboe, Thermal Fatigue Evaluation of Solder Alloys, Bendix Kansas City Division Internal Report, DBX-613-2341 (1980). (10.2172/5563721)
J. Glazer, J. Electron. Mater. 23, 693 (1994). (10.1007/BF02651361) / J. Electron. Mater. by J. Glazer (1994)
H.D. Solomon, Trans. ASME J. Electron. Packaging 113, 102 (1991). (10.1115/1.2905374) / Trans. ASME J. Electron. Packaging by H.D. Solomon (1991)
Y. Kariya and M. Otsuka, J. Electron. Mater 27 (7), 866 (1998). (10.1007/s11664-998-0111-6) / J. Electron. Mater by Y. Kariya (1998)
H.D. Solomon, Electronic Packaging-Materials and Processes, ed. J. A. Sartell, (Materials Park, OH: ASM, 1986), p. 29. / Electronic Packaging-Materials and Processes by H.D. Solomon (1986)
H.D. Solomon, Trans. ASME J. Electron. Packaging 112, 123 (1990). (10.1115/1.2904352) / Trans. ASME J. Electron. Packaging by H.D. Solomon (1990)

Dates

Type	When
Created	18 years, 4 months ago (April 6, 2007, 2:29 a.m.)
Deposited	6 years, 3 months ago (June 1, 2019, 12:04 p.m.)
Indexed	2 months, 1 week ago (June 24, 2025, 7:29 a.m.)
Issued	26 years, 10 months ago (Nov. 1, 1998)
Published	26 years, 10 months ago (Nov. 1, 1998)
Published Print	26 years, 10 months ago (Nov. 1, 1998)

Funders 0

None

BibTeX

@article{Kariya_1998, title={Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys}, volume={27}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/s11664-998-0074-7}, DOI={10.1007/s11664-998-0074-7}, number={11}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Kariya, Yoshiharu and Otsuka, Masahisa}, year={1998}, month=nov, pages={1229–1235} }

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