DOI: 10.1007/s11664-998-0066-7. Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

10.1007/s11664-998-0066-7

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Schaefer, M., Fournelle, R. A., & Liang, J. (1998). Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control. Journal of Electronic Materials, 27(11), 1167â1176.

Authors 3

Matt Schaefer (first)
Raymond A. Fournelle (additional)
Jin Liang (additional)

References 26 Referenced 298

D.R. Frear, Solder Mechanics: A State of the Art Assessment, eds. D.R. Frear, W.B. Jones and K.R. Kinsman, (Warrendale, PA: TMS, 1991), p. 191. / Solder Mechanics: A State of the Art Assessment by D.R. Frear (1991)
D.R. Frear, JOM 48 (5), 49 (1996). (10.1007/BF03222944) / JOM by D.R. Frear (1996)
D.R. Frear and P.T. Vianco, Met. Trans. A 25 (7), 1509 (1994). (10.1007/BF02665483) / Met. Trans. A by D.R. Frear (1994)
J.K. Shang and D. Yao, J. Electron. Packaging 118 (3), 170 (1996). (10.1115/1.2792148) / J. Electron. Packaging by J.K. Shang (1996)
A.J. Sunwoo, J.W. Morris, Jr. and G.K Lucey, Jr., Met. Trans. A 23 (4), 1323 (1992). (10.1007/BF02665064) / Met. Trans. A by A.J. Sunwoo (1992)
M. Onishi, and H. Fujibuchi, Trans. JIM 16, 539 (1975). (10.2320/matertrans1960.16.539) / Trans. JIM by M. Onishi (1975)
P.J. Kay and C.A. Mackay, Trans. Inst. Met. Finishing 54, 68 (1976). (10.1080/00202967.1976.11870376) / Trans. Inst. Met. Finishing by P.J. Kay (1976)
A.D. Romig, Jr., Y.A. Chang, J.J. Stephens, D.R. Frear, V. Marcotte and C. Lea, Solder Mechanics: A State of the Art Assessment, eds. D.R. Frear, W.B. Jones and K.R. Kinsman, (Warrendale, PA: TMS, 1991), p. 29. / Solder Mechanics: A State of the Art Assessment by A.D. Romig Jr. (1991)
Y. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs and R.F Pinizotto, J. Electron. Mater. 22 (7), 769 (1993). (10.1007/BF02817353) / J. Electron. Mater. by Y. Wu (1993)
K.L. Erickson, P.L. Hopkins and P.T. Vianco J. Electron. Mater. 23 (8), 729 (1994). (10.1007/BF02651366) / J. Electron. Mater. by K.L. Erickson (1994)
Z. Mei, A.J. Sunwoo and J.W. Morris, Jr., Met. Trans. A 23 (3), 857 (1992). (10.1007/BF02675563) / Met. Trans. A by Z. Mei (1992)
P.T. Vianco, P.F. Hlava and A.C. Kilgo, J. Electron. Mater. 23 (7), 721 (1994). (10.1007/BF02651365) / J. Electron. Mater. by P.T. Vianco (1994)
P.T. Vianco, K.L. Erickson and P.L. Hopkins, J. Electron. Mater. 23 (8), 721 (1994). (10.1007/BF02651365) / J. Electron. Mater. by P.T. Vianco (1994)
D. Unsworth and C. Mackay, Trans. Inst. Met. Finishing 51, 85 (1973). (10.1080/00202967.1973.11870271) / Trans. Inst. Met. Finishing by D. Unsworth (1973)
H.K. Kim, H.K. Liou and K.N. Tu, Appl. Phys. Lett. 66 (18), 2337 (1995). (10.1063/1.113975) / Appl. Phys. Lett. by H.K. Kim (1995)
M. Schaefer, W. Laub, J.M. Sabee and R.A. Fournelle, J. Electron. Mater. 25 (6), 992 (1993). (10.1007/BF02666735) / J. Electron. Mater. by M. Schaefer (1993)
S. Bader, W. Gust and H. Hieber, Acta Met. 43 (1), 329 (1995). / Acta Met. by S. Bader (1995)
F. Bartels, J.W. Morris, Jr., G. Dalke and W. Gust, J. Electron. Mater. 23 (8), 787 (1994). (10.1007/BF02651374) / J. Electron. Mater. by F. Bartels (1994)
H.K. Kim and K.N. Tu, Appl. Phys. Lett. 67 (14), 2002 (1995). (10.1063/1.114767) / Appl. Phys. Lett. by H.K. Kim (1995)
H.K. Kim and K.N. Tu, Phys. Rev. B 53 (23), 16027 (1996). (10.1103/PhysRevB.53.16027) / Phys. Rev. B by H.K. Kim (1996)
M. Schaefer, W. Laub, R.A. Fournelle and J. Liang, Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara, et al., (Warrendale, PA: TMS, 1997), p. 247. / Design & Reliability of Solders and Solder Interconnections by M. Schaefer (1997)
J. London and D.W. Ashall, Brazing & Soldering 11, 49 (1986). / Brazing & Soldering by J. London (1986)
C. Lea, A Scientific Guide to Surface Mount Technology, (Ayr, Scotland: Electrochemical Publications, 1988), p. 329. / A Scientific Guide to Surface Mount Technology by C. Lea (1988)
F. Bartels, Doctoral dissertation, Stuttgart, Germany: Institut Für Metallkunde der Universität Stuttgart und Max-Plank-Institut Für Metallforschung, 1993.
J.S. Kirkaldy, and D.J. Young, Diffusion in the Condensed State, (London: Institute of Metals, 1987). / Diffusion in the Condensed State by J.S. Kirkaldy (1987)
I. Kaur, Y. Mishin and W. Gust, Fundamentals of Grain and Interphase Boundary Diffusion, (Chichester, England: John Wiley & Sons, 1995). / Fundamentals of Grain and Interphase Boundary Diffusion by I. Kaur (1995)

Dates

Type	When
Created	18 years, 4 months ago (April 6, 2007, 2:29 a.m.)
Deposited	6 years, 2 months ago (June 1, 2019, 12:04 p.m.)
Indexed	2 months, 1 week ago (June 17, 2025, 9:15 a.m.)
Issued	26 years, 9 months ago (Nov. 1, 1998)
Published	26 years, 9 months ago (Nov. 1, 1998)
Published Print	26 years, 9 months ago (Nov. 1, 1998)

Funders 0

None

BibTeX

@article{Schaefer_1998, title={Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control}, volume={27}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/s11664-998-0066-7}, DOI={10.1007/s11664-998-0066-7}, number={11}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Schaefer, Matt and Fournelle, Raymond A. and Liang, Jin}, year={1998}, month=nov, pages={1167–1176} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        6,
        17
      ]
    ],
    "date-time": "2025-06-17T13:15:39Z",
    "timestamp": 1750166139099
  },
  "reference-count": 26,
  "publisher": "Springer Science and Business Media LLC",
  "issue": "11",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            1998,
            11,
            1
          ]
        ],
        "date-time": "1998-11-01T00:00:00Z",
        "timestamp": 909878400000
      },
      "content-version": "tdm",
      "delay-in-days": 0,
      "URL": "http://www.springer.com/tdm"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        1998,
        11
      ]
    ]
  },
  "DOI": "10.1007/s11664-998-0066-7",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2007,
        4,
        6
      ]
    ],
    "date-time": "2007-04-06T06:29:53Z",
    "timestamp": 1175840993000
  },
  "page": "1167-1176",
  "source": "Crossref",
  "is-referenced-by-count": 298,
  "title": "Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control",
  "prefix": "10.1007",
  "volume": "27",
  "author": [
    {
      "given": "Matt",
      "family": "Schaefer",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "Raymond A.",
      "family": "Fournelle",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "Jin",
      "family": "Liang",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "297",
  "reference": [
    {
      "key": "66_CR1",
      "first-page": "191",
      "volume-title": "Solder Mechanics: A State of the Art Assessment",
      "author": "D.R. Frear",
      "year": "1991",
      "unstructured": "D.R. Frear, Solder Mechanics: A State of the Art Assessment, eds. D.R. Frear, W.B. Jones and K.R. Kinsman, (Warrendale, PA: TMS, 1991), p. 191."
    },
    {
      "issue": "5",
      "key": "66_CR2",
      "doi-asserted-by": "crossref",
      "first-page": "49",
      "DOI": "10.1007/BF03222944",
      "volume": "48",
      "author": "D.R. Frear",
      "year": "1996",
      "unstructured": "D.R. Frear, JOM 48 (5), 49 (1996).",
      "journal-title": "JOM"
    },
    {
      "issue": "7",
      "key": "66_CR3",
      "doi-asserted-by": "crossref",
      "first-page": "1509",
      "DOI": "10.1007/BF02665483",
      "volume": "25",
      "author": "D.R. Frear",
      "year": "1994",
      "unstructured": "D.R. Frear and P.T. Vianco, Met. Trans. A 25 (7), 1509 (1994).",
      "journal-title": "Met. Trans. A"
    },
    {
      "issue": "3",
      "key": "66_CR4",
      "doi-asserted-by": "crossref",
      "first-page": "170",
      "DOI": "10.1115/1.2792148",
      "volume": "118",
      "author": "J.K. Shang",
      "year": "1996",
      "unstructured": "J.K. Shang and D. Yao, J. Electron. Packaging 118 (3), 170 (1996).",
      "journal-title": "J. Electron. Packaging"
    },
    {
      "issue": "4",
      "key": "66_CR5",
      "doi-asserted-by": "crossref",
      "first-page": "1323",
      "DOI": "10.1007/BF02665064",
      "volume": "23",
      "author": "A.J. Sunwoo",
      "year": "1992",
      "unstructured": "A.J. Sunwoo, J.W. Morris, Jr. and G.K Lucey, Jr., Met. Trans. A 23 (4), 1323 (1992).",
      "journal-title": "Met. Trans. A"
    },
    {
      "key": "66_CR6",
      "doi-asserted-by": "crossref",
      "first-page": "539",
      "DOI": "10.2320/matertrans1960.16.539",
      "volume": "16",
      "author": "M. Onishi",
      "year": "1975",
      "unstructured": "M. Onishi, and H. Fujibuchi, Trans. JIM 16, 539 (1975).",
      "journal-title": "Trans. JIM"
    },
    {
      "key": "66_CR7",
      "doi-asserted-by": "crossref",
      "first-page": "68",
      "DOI": "10.1080/00202967.1976.11870376",
      "volume": "54",
      "author": "P.J. Kay",
      "year": "1976",
      "unstructured": "P.J. Kay and C.A. Mackay, Trans. Inst. Met. Finishing 54, 68 (1976).",
      "journal-title": "Trans. Inst. Met. Finishing"
    },
    {
      "key": "66_CR8",
      "first-page": "29",
      "volume-title": "Solder Mechanics: A State of the Art Assessment",
      "author": "A.D. Romig Jr.",
      "year": "1991",
      "unstructured": "A.D. Romig, Jr., Y.A. Chang, J.J. Stephens, D.R. Frear, V. Marcotte and C. Lea, Solder Mechanics: A State of the Art Assessment, eds. D.R. Frear, W.B. Jones and K.R. Kinsman, (Warrendale, PA: TMS, 1991), p. 29."
    },
    {
      "issue": "7",
      "key": "66_CR9",
      "doi-asserted-by": "crossref",
      "first-page": "769",
      "DOI": "10.1007/BF02817353",
      "volume": "22",
      "author": "Y. Wu",
      "year": "1993",
      "unstructured": "Y. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs and R.F Pinizotto, J. Electron. Mater. 22 (7), 769 (1993).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "issue": "8",
      "key": "66_CR10",
      "doi-asserted-by": "crossref",
      "first-page": "729",
      "DOI": "10.1007/BF02651366",
      "volume": "23",
      "author": "K.L. Erickson",
      "year": "1994",
      "unstructured": "K.L. Erickson, P.L. Hopkins and P.T. Vianco J. Electron. Mater. 23 (8), 729 (1994).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "issue": "3",
      "key": "66_CR11",
      "doi-asserted-by": "crossref",
      "first-page": "857",
      "DOI": "10.1007/BF02675563",
      "volume": "23",
      "author": "Z. Mei",
      "year": "1992",
      "unstructured": "Z. Mei, A.J. Sunwoo and J.W. Morris, Jr., Met. Trans. A 23 (3), 857 (1992).",
      "journal-title": "Met. Trans. A"
    },
    {
      "issue": "7",
      "key": "66_CR12",
      "doi-asserted-by": "crossref",
      "first-page": "721",
      "DOI": "10.1007/BF02651365",
      "volume": "23",
      "author": "P.T. Vianco",
      "year": "1994",
      "unstructured": "P.T. Vianco, P.F. Hlava and A.C. Kilgo, J. Electron. Mater. 23 (7), 721 (1994).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "issue": "8",
      "key": "66_CR13",
      "doi-asserted-by": "crossref",
      "first-page": "721",
      "DOI": "10.1007/BF02651365",
      "volume": "23",
      "author": "P.T. Vianco",
      "year": "1994",
      "unstructured": "P.T. Vianco, K.L. Erickson and P.L. Hopkins, J. Electron. Mater. 23 (8), 721 (1994).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "key": "66_CR14",
      "doi-asserted-by": "crossref",
      "first-page": "85",
      "DOI": "10.1080/00202967.1973.11870271",
      "volume": "51",
      "author": "D. Unsworth",
      "year": "1973",
      "unstructured": "D. Unsworth and C. Mackay, Trans. Inst. Met. Finishing 51, 85 (1973).",
      "journal-title": "Trans. Inst. Met. Finishing"
    },
    {
      "issue": "18",
      "key": "66_CR15",
      "doi-asserted-by": "crossref",
      "first-page": "2337",
      "DOI": "10.1063/1.113975",
      "volume": "66",
      "author": "H.K. Kim",
      "year": "1995",
      "unstructured": "H.K. Kim, H.K. Liou and K.N. Tu, Appl. Phys. Lett. 66 (18), 2337 (1995).",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "issue": "6",
      "key": "66_CR16",
      "doi-asserted-by": "crossref",
      "first-page": "992",
      "DOI": "10.1007/BF02666735",
      "volume": "25",
      "author": "M. Schaefer",
      "year": "1993",
      "unstructured": "M. Schaefer, W. Laub, J.M. Sabee and R.A. Fournelle, J. Electron. Mater. 25 (6), 992 (1993).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "issue": "1",
      "key": "66_CR17",
      "first-page": "329",
      "volume": "43",
      "author": "S. Bader",
      "year": "1995",
      "unstructured": "S. Bader, W. Gust and H. Hieber, Acta Met. 43 (1), 329 (1995).",
      "journal-title": "Acta Met."
    },
    {
      "issue": "8",
      "key": "66_CR18",
      "doi-asserted-by": "crossref",
      "first-page": "787",
      "DOI": "10.1007/BF02651374",
      "volume": "23",
      "author": "F. Bartels",
      "year": "1994",
      "unstructured": "F. Bartels, J.W. Morris, Jr., G. Dalke and W. Gust, J. Electron. Mater. 23 (8), 787 (1994).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "issue": "14",
      "key": "66_CR19",
      "doi-asserted-by": "crossref",
      "first-page": "2002",
      "DOI": "10.1063/1.114767",
      "volume": "67",
      "author": "H.K. Kim",
      "year": "1995",
      "unstructured": "H.K. Kim and K.N. Tu, Appl. Phys. Lett. 67 (14), 2002 (1995).",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "issue": "23",
      "key": "66_CR20",
      "doi-asserted-by": "crossref",
      "first-page": "16027",
      "DOI": "10.1103/PhysRevB.53.16027",
      "volume": "53",
      "author": "H.K. Kim",
      "year": "1996",
      "unstructured": "H.K. Kim and K.N. Tu, Phys. Rev. B 53 (23), 16027 (1996).",
      "journal-title": "Phys. Rev. B"
    },
    {
      "key": "66_CR21",
      "first-page": "247",
      "volume-title": "Design & Reliability of Solders and Solder Interconnections",
      "author": "M. Schaefer",
      "year": "1997",
      "unstructured": "M. Schaefer, W. Laub, R.A. Fournelle and J. Liang, Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara, et al., (Warrendale, PA: TMS, 1997), p. 247."
    },
    {
      "key": "66_CR22",
      "first-page": "49",
      "volume": "11",
      "author": "J. London",
      "year": "1986",
      "unstructured": "J. London and D.W. Ashall, Brazing & Soldering 11, 49 (1986).",
      "journal-title": "Brazing & Soldering"
    },
    {
      "key": "66_CR23",
      "first-page": "329",
      "volume-title": "A Scientific Guide to Surface Mount Technology",
      "author": "C. Lea",
      "year": "1988",
      "unstructured": "C. Lea, A Scientific Guide to Surface Mount Technology, (Ayr, Scotland: Electrochemical Publications, 1988), p. 329."
    },
    {
      "key": "66_CR24",
      "unstructured": "F. Bartels, Doctoral dissertation, Stuttgart, Germany: Institut F\u00fcr Metallkunde der Universit\u00e4t Stuttgart und Max-Plank-Institut F\u00fcr Metallforschung, 1993."
    },
    {
      "key": "66_CR25",
      "volume-title": "Diffusion in the Condensed State",
      "author": "J.S. Kirkaldy",
      "year": "1987",
      "unstructured": "J.S. Kirkaldy, and D.J. Young, Diffusion in the Condensed State, (London: Institute of Metals, 1987)."
    },
    {
      "key": "66_CR26",
      "volume-title": "Fundamentals of Grain and Interphase Boundary Diffusion",
      "author": "I. Kaur",
      "year": "1995",
      "unstructured": "I. Kaur, Y. Mishin and W. Gust, Fundamentals of Grain and Interphase Boundary Diffusion, (Chichester, England: John Wiley & Sons, 1995)."
    }
  ],
  "container-title": "Journal of Electronic Materials",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "http://link.springer.com/content/pdf/10.1007/s11664-998-0066-7.pdf",
      "content-type": "application/pdf",
      "content-version": "vor",
      "intended-application": "text-mining"
    },
    {
      "URL": "http://link.springer.com/article/10.1007/s11664-998-0066-7/fulltext.html",
      "content-type": "text/html",
      "content-version": "vor",
      "intended-application": "text-mining"
    },
    {
      "URL": "http://link.springer.com/content/pdf/10.1007/s11664-998-0066-7",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2019,
        6,
        1
      ]
    ],
    "date-time": "2019-06-01T16:04:36Z",
    "timestamp": 1559405076000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://link.springer.com/10.1007/s11664-998-0066-7"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1998,
        11
      ]
    ]
  },
  "references-count": 26,
  "journal-issue": {
    "issue": "11",
    "published-print": {
      "date-parts": [
        [
          1998,
          11
        ]
      ]
    }
  },
  "alternative-id": [
    "66"
  ],
  "URL": "http://dx.doi.org/10.1007/s11664-998-0066-7",
  "relation": {},
  "ISSN": [
    "0361-5235",
    "1543-186X"
  ],
  "subject": [],
  "container-title-short": "Journal of Elec Materi",
  "published": {
    "date-parts": [
      [
        1998,
        11
      ]
    ]
  }
}