DOI: 10.1007/s11664-003-0196-x. New layer transfers obtained by the SmartCut process

New layer transfers obtained by the SmartCut process

10.1007/s11664-003-0196-x

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Moriceau, H., Fournel, F., Aspar, B., Bataillou, B., Beaumont, A., Morales, C., Cartier, A. M., Pocas, S., Lagahe, C., Jalaguier, E., Soubie, A., Biasse, B., Sousbie, N., Sartori, S., Michaud, J. F., Letertre, F., Rayssac, O., Cayrefourcq, I., Richtarch, C., â¦ MazurÃ©, C. (2003). New layer transfers obtained by the SmartCut process. Journal of Electronic Materials, 32(8), 829â835.

Authors 25

H. Moriceau (first)
F. Fournel (additional)
B. Aspar (additional)
B. Bataillou (additional)
A. Beaumont (additional)
C. Morales (additional)
A. M. Cartier (additional)
S. Pocas (additional)
C. Lagahe (additional)
E. Jalaguier (additional)
A. Soubie (additional)
B. Biasse (additional)
N. Sousbie (additional)
S. Sartori (additional)
J. F. Michaud (additional)
F. Letertre (additional)
O. Rayssac (additional)
I. Cayrefourcq (additional)
C. Richtarch (additional)
N. Daval (additional)
C. Aulentte (additional)
T. Akatsu (additional)
B. Osternaud (additional)
B. Ghyselen (additional)
C. Mazuré (additional)

References 20 Referenced 16

M. Bruel, Electron. Lett. 31, 1201 (1995). SmartCut and Unibond are registered trademarks of SOITEC, Parc Technologique des Fontaines, 38190 Bernin, France. (10.1049/el:19950805) / Electron. Lett. by M. Bruel (1995)
L. Di Cioccio, Y. Le Tiec, F. Letertre, C. Jaussaud, and M. Bruel, Electron. Lett. 32, 1144 (1996). (10.1049/el:19960717) / Electron. Lett. by L. Cioccio Di (1996)
E. Jalaguier, B. Aspar, S. Pocas, J.F. Michaud, M. Zussy, and M. Bruel, Electron. Lett. 34, 408 (1998). (10.1049/el:19980265) / Electron. Lett. by E. Jalaguier (1998)
E. Jalaguier et al. Proc. 11th Int. Conf. on InP Related Materials (Piscataway, NJ: IEEE, 1999), pp. 26–27. / Proc. 11th Int. Conf. on InP Related Materials by E. Jalaguier (1999)
U. Gösele et al., J. Vac. Sci. Technol. A 17, 1145 (1999). (10.1116/1.581788) / J. Vac. Sci. Technol. A by U. Gösele (1999)
F.J. Kub, K.D. Hobart, J.M. Pond, and S.W. Kirchoefer, Electron. Lett. 35, 477 (1999). (10.1049/el:19990354) / Electron. Lett. by F.J. Kub (1999)
B. Aspar, et al., J. Electron. Mater. 30, 834 (2001). (10.1007/s11664-001-0067-2) / J. Electron. Mater. by B. Aspar (2001)
H. Moriceau, B. Aspar, M. Bruel, A.M. Cartier, C. Morales, A. Soubie, T. Barge, S. Bressot, C. Maleville, and A.J. Auberton, Electrochem. Soc. Proc. 99, 173 (1999). / Electrochem. Soc. Proc. by H. Moriceau (1999)
J.O. Chu, Proc. 2002 Int. Conf. on Alternative Substrate Technology, Cancun, Mexico, 15–19 September 2002.
B. Aspar, E. Jalaguier, A. Mas, C. Locatelli, O. Rayssac, H. Moriceau, S. Pocas, A.M. Papon, J.F. Michaud, and M. Bruel, Electron. Lett. 35, 12 (1999). (10.1049/el:19990663) / Electron. Lett. by B. Aspar (1999)
L. Di Cioccio, Y.L. Tiec, C. Jaussaud, E. Hugonnard-Bruyere, and M. Bruel. Mater. Sci. Forum 264–268, 765 (1998). (10.4028/www.scientific.net/MSF.264-268.765) / Mater. Sci. Forum by L. Cioccio Di (1998)
J. Grisolia, G. Ben Assayag, B. Aspar, C. Jaussaud, L. Di Cioccio, and A. Claverie, MRS Spring Meeting, San Francisco, 5–9 April (1999).
B. Aspar, C. Lagahe, H. Moriceau, E. Jalaguier, A. Mas, O. Rayssac, M. Bruel, A.J. Auberton-Hervé, T. Barge, and F. Letertre, 5th Int. Symp. on Semiconductor Wafer Bonding Science, Hawaii, 17–22 October 1999.
M. Bruel, World patent 9,905,711, 22 July, 1997.
F. Fournel, H. Moriceau, N. Magnea, J. Eymery, J.L. Rouvière, K. Rousseau, and B. Aspar, Mater. Sci. Eng. B 73, 42 (2000) (10.1016/S0921-5107(99)00431-6) / Mater. Sci. Eng. B by F. Fournel (2000)
J. Kish, A. Fred, and A. David, U.S. patent 5,661,316, 26 August, 1997.
R.A. Wind, M.J. Murtagh, Fang-Mei, Yu-Wang, M.A. Hines, and S.L. Sass, Appl. Phys. Lett. 78, 2205 (2001). (10.1063/1.1362330) / Appl. Phys. Lett. by R.A. Wind (2001)
F. Fournel, H. Moriceau, B. Aspar, K. Rousseau, J. Eymery, J.L. Rouvière, and N. Magnea, Appl. Phys. Lett. 80, 793 (2002). (10.1063/1.1446987) / Appl. Phys. Lett. by F. Fournel (2002)
J.L. Rouviere, K. Rousseau, F. Fournel, and H. Moriceau, Appl. Phys. Lett. 77, 1135 (2000). (10.1063/1.1289656) / Appl. Phys. Lett. by J.L. Rouviere (2000)
D. Buttard, J. Eymery, F. Rieutord, F. Fournel, D. Lubbert, T. Baumbach, and H. Moriceau, Physica B 283, 103 (2000). (10.1016/S0921-4526(99)01900-6) / Physica B by D. Buttard (2000)

Dates

Type	When
Created	18 years, 4 months ago (April 6, 2007, 9:30 a.m.)
Deposited	6 years, 3 months ago (June 1, 2019, 3:44 p.m.)
Indexed	1 month, 1 week ago (July 24, 2025, 7:35 a.m.)
Issued	22 years, 1 month ago (Aug. 1, 2003)
Published	22 years, 1 month ago (Aug. 1, 2003)
Published Print	22 years, 1 month ago (Aug. 1, 2003)

Funders 0

None

BibTeX

@article{Moriceau_2003, title={New layer transfers obtained by the SmartCut process}, volume={32}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/s11664-003-0196-x}, DOI={10.1007/s11664-003-0196-x}, number={8}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Moriceau, H. and Fournel, F. and Aspar, B. and Bataillou, B. and Beaumont, A. and Morales, C. and Cartier, A. M. and Pocas, S. and Lagahe, C. and Jalaguier, E. and Soubie, A. and Biasse, B. and Sousbie, N. and Sartori, S. and Michaud, J. F. and Letertre, F. and Rayssac, O. and Cayrefourcq, I. and Richtarch, C. and Daval, N. and Aulentte, C. and Akatsu, T. and Osternaud, B. and Ghyselen, B. and Mazuré, C.}, year={2003}, month=aug, pages={829–835} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        7,
        24
      ]
    ],
    "date-time": "2025-07-24T11:35:15Z",
    "timestamp": 1753356915133
  },
  "reference-count": 20,
  "publisher": "Springer Science and Business Media LLC",
  "issue": "8",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            2003,
            8,
            1
          ]
        ],
        "date-time": "2003-08-01T00:00:00Z",
        "timestamp": 1059696000000
      },
      "content-version": "tdm",
      "delay-in-days": 0,
      "URL": "http://www.springer.com/tdm"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        2003,
        8
      ]
    ]
  },
  "DOI": "10.1007/s11664-003-0196-x",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2007,
        4,
        6
      ]
    ],
    "date-time": "2007-04-06T13:30:34Z",
    "timestamp": 1175866234000
  },
  "page": "829-835",
  "source": "Crossref",
  "is-referenced-by-count": 16,
  "title": "New layer transfers obtained by the SmartCut process",
  "prefix": "10.1007",
  "volume": "32",
  "author": [
    {
      "given": "H.",
      "family": "Moriceau",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "F.",
      "family": "Fournel",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "B.",
      "family": "Aspar",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "B.",
      "family": "Bataillou",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "A.",
      "family": "Beaumont",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "C.",
      "family": "Morales",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "A. M.",
      "family": "Cartier",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "S.",
      "family": "Pocas",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "C.",
      "family": "Lagahe",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "E.",
      "family": "Jalaguier",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "A.",
      "family": "Soubie",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "B.",
      "family": "Biasse",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "N.",
      "family": "Sousbie",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "S.",
      "family": "Sartori",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "J. F.",
      "family": "Michaud",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "F.",
      "family": "Letertre",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "O.",
      "family": "Rayssac",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "I.",
      "family": "Cayrefourcq",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "C.",
      "family": "Richtarch",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "N.",
      "family": "Daval",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "C.",
      "family": "Aulentte",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "T.",
      "family": "Akatsu",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "B.",
      "family": "Osternaud",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "B.",
      "family": "Ghyselen",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "C.",
      "family": "Mazur\u00e9",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "297",
  "reference": [
    {
      "key": "196_CR1",
      "doi-asserted-by": "crossref",
      "first-page": "1201",
      "DOI": "10.1049/el:19950805",
      "volume": "31",
      "author": "M. Bruel",
      "year": "1995",
      "unstructured": "M. Bruel, Electron. Lett. 31, 1201 (1995). SmartCut and Unibond are registered trademarks of SOITEC, Parc Technologique des Fontaines, 38190 Bernin, France.",
      "journal-title": "Electron. Lett."
    },
    {
      "key": "196_CR2",
      "doi-asserted-by": "crossref",
      "first-page": "1144",
      "DOI": "10.1049/el:19960717",
      "volume": "32",
      "author": "L. Cioccio Di",
      "year": "1996",
      "unstructured": "L. Di Cioccio, Y. Le Tiec, F. Letertre, C. Jaussaud, and M. Bruel, Electron. Lett. 32, 1144 (1996).",
      "journal-title": "Electron. Lett."
    },
    {
      "key": "196_CR3",
      "doi-asserted-by": "crossref",
      "first-page": "408",
      "DOI": "10.1049/el:19980265",
      "volume": "34",
      "author": "E. Jalaguier",
      "year": "1998",
      "unstructured": "E. Jalaguier, B. Aspar, S. Pocas, J.F. Michaud, M. Zussy, and M. Bruel, Electron. Lett. 34, 408 (1998).",
      "journal-title": "Electron. Lett."
    },
    {
      "key": "196_CR4",
      "first-page": "26",
      "volume-title": "Proc. 11th Int. Conf. on InP Related Materials",
      "author": "E. Jalaguier",
      "year": "1999",
      "unstructured": "E. Jalaguier et al. Proc. 11th Int. Conf. on InP Related Materials (Piscataway, NJ: IEEE, 1999), pp. 26\u201327."
    },
    {
      "key": "196_CR5",
      "doi-asserted-by": "crossref",
      "first-page": "1145",
      "DOI": "10.1116/1.581788",
      "volume": "17",
      "author": "U. G\u00f6sele",
      "year": "1999",
      "unstructured": "U. G\u00f6sele et al., J. Vac. Sci. Technol. A 17, 1145 (1999).",
      "journal-title": "J. Vac. Sci. Technol. A"
    },
    {
      "key": "196_CR6",
      "doi-asserted-by": "crossref",
      "first-page": "477",
      "DOI": "10.1049/el:19990354",
      "volume": "35",
      "author": "F.J. Kub",
      "year": "1999",
      "unstructured": "F.J. Kub, K.D. Hobart, J.M. Pond, and S.W. Kirchoefer, Electron. Lett. 35, 477 (1999).",
      "journal-title": "Electron. Lett."
    },
    {
      "key": "196_CR7",
      "doi-asserted-by": "crossref",
      "first-page": "834",
      "DOI": "10.1007/s11664-001-0067-2",
      "volume": "30",
      "author": "B. Aspar",
      "year": "2001",
      "unstructured": "B. Aspar, et al., J. Electron. Mater. 30, 834 (2001).",
      "journal-title": "J. Electron. Mater."
    },
    {
      "key": "196_CR8",
      "first-page": "173",
      "volume": "99",
      "author": "H. Moriceau",
      "year": "1999",
      "unstructured": "H. Moriceau, B. Aspar, M. Bruel, A.M. Cartier, C. Morales, A. Soubie, T. Barge, S. Bressot, C. Maleville, and A.J. Auberton, Electrochem. Soc. Proc. 99, 173 (1999).",
      "journal-title": "Electrochem. Soc. Proc."
    },
    {
      "key": "196_CR9",
      "unstructured": "J.O. Chu, Proc. 2002 Int. Conf. on Alternative Substrate Technology, Cancun, Mexico, 15\u201319 September 2002."
    },
    {
      "key": "196_CR10",
      "doi-asserted-by": "crossref",
      "first-page": "12",
      "DOI": "10.1049/el:19990663",
      "volume": "35",
      "author": "B. Aspar",
      "year": "1999",
      "unstructured": "B. Aspar, E. Jalaguier, A. Mas, C. Locatelli, O. Rayssac, H. Moriceau, S. Pocas, A.M. Papon, J.F. Michaud, and M. Bruel, Electron. Lett. 35, 12 (1999).",
      "journal-title": "Electron. Lett."
    },
    {
      "key": "196_CR11",
      "doi-asserted-by": "crossref",
      "first-page": "765",
      "DOI": "10.4028/www.scientific.net/MSF.264-268.765",
      "volume": "264\u2013268",
      "author": "L. Cioccio Di",
      "year": "1998",
      "unstructured": "L. Di Cioccio, Y.L. Tiec, C. Jaussaud, E. Hugonnard-Bruyere, and M. Bruel. Mater. Sci. Forum 264\u2013268, 765 (1998).",
      "journal-title": "Mater. Sci. Forum"
    },
    {
      "key": "196_CR12",
      "unstructured": "J. Grisolia, G. Ben Assayag, B. Aspar, C. Jaussaud, L. Di Cioccio, and A. Claverie, MRS Spring Meeting, San Francisco, 5\u20139 April (1999)."
    },
    {
      "key": "196_CR13",
      "unstructured": "B. Aspar, C. Lagahe, H. Moriceau, E. Jalaguier, A. Mas, O. Rayssac, M. Bruel, A.J. Auberton-Herv\u00e9, T. Barge, and F. Letertre, 5th Int. Symp. on Semiconductor Wafer Bonding Science, Hawaii, 17\u201322 October 1999."
    },
    {
      "key": "196_CR14",
      "unstructured": "M. Bruel, World patent 9,905,711, 22 July, 1997."
    },
    {
      "key": "196_CR15",
      "doi-asserted-by": "crossref",
      "first-page": "42",
      "DOI": "10.1016/S0921-5107(99)00431-6",
      "volume": "73",
      "author": "F. Fournel",
      "year": "2000",
      "unstructured": "F. Fournel, H. Moriceau, N. Magnea, J. Eymery, J.L. Rouvi\u00e8re, K. Rousseau, and B. Aspar, Mater. Sci. Eng. B 73, 42 (2000)",
      "journal-title": "Mater. Sci. Eng. B"
    },
    {
      "key": "196_CR16",
      "unstructured": "J. Kish, A. Fred, and A. David, U.S. patent 5,661,316, 26 August, 1997."
    },
    {
      "key": "196_CR17",
      "doi-asserted-by": "crossref",
      "first-page": "2205",
      "DOI": "10.1063/1.1362330",
      "volume": "78",
      "author": "R.A. Wind",
      "year": "2001",
      "unstructured": "R.A. Wind, M.J. Murtagh, Fang-Mei, Yu-Wang, M.A. Hines, and S.L. Sass, Appl. Phys. Lett. 78, 2205 (2001).",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "key": "196_CR18",
      "doi-asserted-by": "crossref",
      "first-page": "793",
      "DOI": "10.1063/1.1446987",
      "volume": "80",
      "author": "F. Fournel",
      "year": "2002",
      "unstructured": "F. Fournel, H. Moriceau, B. Aspar, K. Rousseau, J. Eymery, J.L. Rouvi\u00e8re, and N. Magnea, Appl. Phys. Lett. 80, 793 (2002).",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "key": "196_CR19",
      "doi-asserted-by": "crossref",
      "first-page": "1135",
      "DOI": "10.1063/1.1289656",
      "volume": "77",
      "author": "J.L. Rouviere",
      "year": "2000",
      "unstructured": "J.L. Rouviere, K. Rousseau, F. Fournel, and H. Moriceau, Appl. Phys. Lett. 77, 1135 (2000).",
      "journal-title": "Appl. Phys. Lett."
    },
    {
      "key": "196_CR20",
      "doi-asserted-by": "crossref",
      "first-page": "103",
      "DOI": "10.1016/S0921-4526(99)01900-6",
      "volume": "283",
      "author": "D. Buttard",
      "year": "2000",
      "unstructured": "D. Buttard, J. Eymery, F. Rieutord, F. Fournel, D. Lubbert, T. Baumbach, and H. Moriceau, Physica B 283, 103 (2000).",
      "journal-title": "Physica B"
    }
  ],
  "container-title": "Journal of Electronic Materials",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "http://link.springer.com/content/pdf/10.1007/s11664-003-0196-x.pdf",
      "content-type": "application/pdf",
      "content-version": "vor",
      "intended-application": "text-mining"
    },
    {
      "URL": "http://link.springer.com/article/10.1007/s11664-003-0196-x/fulltext.html",
      "content-type": "text/html",
      "content-version": "vor",
      "intended-application": "text-mining"
    },
    {
      "URL": "http://link.springer.com/content/pdf/10.1007/s11664-003-0196-x",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2019,
        6,
        1
      ]
    ],
    "date-time": "2019-06-01T19:44:21Z",
    "timestamp": 1559418261000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://link.springer.com/10.1007/s11664-003-0196-x"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2003,
        8
      ]
    ]
  },
  "references-count": 20,
  "journal-issue": {
    "issue": "8",
    "published-print": {
      "date-parts": [
        [
          2003,
          8
        ]
      ]
    }
  },
  "alternative-id": [
    "196"
  ],
  "URL": "http://dx.doi.org/10.1007/s11664-003-0196-x",
  "relation": {},
  "ISSN": [
    "0361-5235",
    "1543-186X"
  ],
  "subject": [],
  "container-title-short": "Journal of Elec Materi",
  "published": {
    "date-parts": [
      [
        2003,
        8
      ]
    ]
  }
}