DOI: 10.1007/s11664-001-0150-8. Stress relaxation behavior of composite and eutectic Sn-Ag solder joints

Stress relaxation behavior of composite and eutectic Sn-Ag solder joints

10.1007/s11664-001-0150-8

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Jadhav, S. G., Bieler, T. R., Subramanian, K. N., & Lucas, J. P. (2001). Stress relaxation behavior of composite and eutectic Sn-Ag solder joints. Journal of Electronic Materials, 30(9).

Authors 4

S. G. Jadhav (first)
T. R. Bieler (additional)
K. N. Subramanian (additional)
J. P. Lucas (additional)

References 18 Referenced 48

M. Abtew and G. Selvaduray, Mater. Sci. and Eng. R27, 95 (2000). (10.1016/S0927-796X(00)00010-3) / Mater. Sci. and Eng. by M. Abtew (2000)
R. Darveaux and K. Banerji, IEEE Transactions on Components, Hybrids Mfg. 15, 1014 (1992). / IEEE Transactions on Components, Hybrids Mfg. by R. Darveaux (1992)
J. Glazer, Int. Mater. Rev. 40, 2, 65 (1995). (10.1179/imr.1995.40.2.65) / Int. Mater. Rev. by J. Glazer (1995)
H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine, J. Electron. Mater. 26, 784 (1997). (10.1007/s11664-997-0252-z) / J. Electron. Mater. by H. Mavoori (1997)
E.W. Hare and R.G. Stang, J. Electron. Mater. 24, 1474 (1995). / J. Electron. Mater. by E.W. Hare (1995)
E. Baker, Mater. Sci. and Eng. 38, 24 (1979). (10.1016/0025-5416(79)90128-9) / Mater. Sci. and Eng. by E. Baker (1979)
R.W. Rohde and J.C. Swearengen, J. Eng. Mater. and Technol. 102, 207 (1980). (10.1115/1.3224799) / J. Eng. Mater. and Technol. by R.W. Rohde (1980)
R. Arrowood and A.K. Mukherjee, Mater. Sci. and Eng. 92, 33 (1987). (10.1016/0025-5416(87)90154-6) / Mater. Sci. and Eng. by R. Arrowood (1987)
J. Mcdougall, S. Choi, K.N. Subramanian, T.R. Bieler, and J.P. Lucas, Mater. Sci. and Eng. A285, 25 (1999). / Mater. Sci. and Eng. by J. Mcdougall (1999)
S.G. Jadhav (M.S. Thesis, Michigan State University, 2001).
J.P. Lucas, F. Guo, J. McDougall, T.R. Bieler, K.N. Subramanian, and J.K. Park, J. Electron. Mater. 28, 1209 (1999). (10.1007/s11664-999-0167-y) / J. Electron. Mater. by J.P. Lucas (1999)
E.W. Hart., Stress Relaxation Testing (Philadelphia, PA: ASTM, 1979), p. 5. (10.1520/STP37412S) / Stress Relaxation Testing by E.W. Hart (1979)
R. Darveaux and I. Turlik, Proc. 1990 Intersociety Conf. on Thermal Phenomena in Electron. Systems, (I-Therm II) (Piscataway, NJ: IEEE, 1990), p. 40. / Proc. 1990 Intersociety Conf. on Thermal Phenomena in Electron. Systems, (I-Therm II) by R. Darveaux (1990)
S. Choi, J.G. Lee, F. Guo, T.R. Bieler, K.N. Subramanian, and J.P. Lucas, JOM 53 (6) (2001), pp. 22–26. (10.1007/s11837-001-0098-4) / JOM by S. Choi (2001)
K.L. Murty, H. Yang, P. Deane, and P. Magill, Adv. in Electron. Pkg. 1, 1221 (1997). / Adv. in Electron. Pkg. by K.L. Murty (1997)
E. Orowan, Proc. Phys. Soc. 52, 1 (1940). (10.1088/0959-5309/52/1/303) / Proc. Phys. Soc. by E. Orowan (1940)
A.A. Solomon and W.D. Nix, Acta Metall. 18, 863 (1970). (10.1016/0001-6160(70)90014-3) / Acta Metall. by A.A. Solomon (1970)
G.J. Lloyd and R.J. McErloy, Acta Metall. 22, 339 (1974). (10.1016/0001-6160(74)90173-4) / Acta Metall. by G.J. Lloyd (1974)

Dates

Type	When
Created	18 years, 1 month ago (June 30, 2007, 1:28 a.m.)
Deposited	3 years, 3 months ago (May 15, 2022, 9:15 a.m.)
Indexed	5 days, 7 hours ago (Aug. 21, 2025, 1:42 p.m.)
Issued	23 years, 11 months ago (Sept. 1, 2001)
Published	23 years, 11 months ago (Sept. 1, 2001)
Published Print	23 years, 11 months ago (Sept. 1, 2001)

Funders 0

None

BibTeX

@article{Jadhav_2001, title={Stress relaxation behavior of composite and eutectic Sn-Ag solder joints}, volume={30}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/s11664-001-0150-8}, DOI={10.1007/s11664-001-0150-8}, number={9}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Jadhav, S. G. and Bieler, T. R. and Subramanian, K. N. and Lucas, J. P.}, year={2001}, month=sep }

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