DOI: 10.1007/s11664-000-0152-y. Interfacial reactions between liquid indium and Au-deposited substrates

Interfacial reactions between liquid indium and Au-deposited substrates

10.1007/s11664-000-0152-y

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Liu, Y. M., & Chuang, T. H. (2000). Interfacial reactions between liquid indium and Au-deposited substrates. Journal of Electronic Materials, 29(4), 405â410.

Authors 2

Y. M. Liu (first)
T. H. Chuang (additional)

References 25 Referenced 65

S.K. Kang, J. Electron. Mater. 23, 701 (1994). (10.1007/BF02651362) / J. Electron. Mater. by S.K. Kang (1994)
J. Glazer, Int. Mater. Rev. 40, 65 (1995). (10.1179/imr.1995.40.2.65) / Int. Mater. Rev. by J. Glazer (1995)
T. Laine-Ylijoki, H. Steen, and A. Forsten, IEEE Trans. Comp., Pac. Man. Tech. 20, 194 (1997). (10.1109/3476.649440) / IEEE Trans. Comp., Pac. Man. Tech. by T. Laine-Ylijoki (1997)
J. Glazer, J. Electron. Mater. 23, 693 (1994). (10.1007/BF02651361) / J. Electron. Mater. by J. Glazer (1994)
K. Shimizu, T. Nakanishi, K. Karasawa, K. Hashimoto, and K. Niwa, J. Electron. Mater. 24, 39 (1996). (10.1007/BF02659725) / J. Electron. Mater. by K. Shimizu (1996)
R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, Microelectronics Packaging Handbook (New York: Chapman & Hall, 1997). / Microelectronics Packaging Handbook by R.R. Tummala (1997)
S.K. Mil’shtein, J.M. Parsey, Jr., D.V. Lang, D.C. Joy, and H. Temkin, IEEE Trans. Comp., Pac. Man. Tech. 8, 397 (1985). (10.1109/TCHMT.1985.1136504) / IEEE Trans. Comp., Pac. Man. Tech. by S.K. Mil’shtein (1985)
M. Mori, M. Saito, A. Hongu, A. Niitsuma, and H. Ohdaira, IEEE Trans. Comp., Pac. Man. Tech. 13, 444 (1992). (10.1109/33.56182) / IEEE Trans. Comp., Pac. Man. Tech. by M. Mori (1992)
C.C. Lee, C.Y. Wang, and G. Matijasevic, J. Electron. Pac. 115, 201 (1993). (10.1115/1.2909318) / J. Electron. Pac. by C.C. Lee (1993)
G.W. Powell and J.D. Braun, Trans. AIME 230, 694 (1964). / Trans. AIME by G.W. Powell (1964)
V. Simic and Z. Marinkovic, Thin Solid Films 41, 57 (1977). (10.1016/0040-6090(77)90009-8) / Thin Solid Films by V. Simic (1977)
J. Bjøntegaard, L. Buene, T. Finstad, O. Lonsjo, and T. Olsen, Thin Solid Films 101, 253 (1983). (10.1016/0040-6090(83)90252-3) / Thin Solid Films by J. Bjøntegaard (1983)
Y. Husumi, J. Appl. Phys. 58, 308 (1985). / J. Appl. Phys. by Y. Husumi (1985)
M. Milliares, B. Pieraggi, and E. Lelievre, Scrip. Metal. Mater. 27, 1777 (1992). (10.1016/0956-716X(92)90018-A) / Scrip. Metal. Mater. by M. Milliares (1992)
F.G. Yost, F.P. Ganyard, and M.M. Karnowsky, Metal. Trans. 7A 1141 (1976). (10.1007/BF02656596) / Metal. Trans. by F.G. Yost (1976)
F.G. Yost, Gold Bull. 10, 94 (1977). (10.1007/BF03215439) / Gold Bull. by F.G. Yost (1977)
I. Shohji, S. Fujiwara, S. Kiyono, and K.F. Kobayashi, Scrip. Mater. 40, 815 (1999). (10.1016/S1359-6462(99)00007-X) / Scrip. Mater. by I. Shohji (1999)
D.M. Jacobson and G. Humpston, Gold Bull. 22, 9 (1989). (10.1007/BF03214704) / Gold Bull. by D.M. Jacobson (1989)
C.R. Kao, Mater. Sci. Eng. A238, 196 (1997). (10.1016/S0921-5093(97)00449-8) / Mater. Sci. Eng. by C.R. Kao (1997)
P.G. Kim and K.N. Tu, Mater. Chem. Phys. 53, 165 (1998). (10.1016/S0254-0584(97)02076-2) / Mater. Chem. Phys. by P.G. Kim (1998)
X.H. Wang and H. Conrad, Scrip. Metal. Mater. 30, 725 (1994). (10.1016/0956-716X(94)90189-9) / Scrip. Metal. Mater. by X.H. Wang (1994)
X.H. Wang and H. Conrad, Scrip. Metal. Mater. 31, 375 (1994). (10.1016/0956-716X(94)90003-5) / Scrip. Metal. Mater. by X.H. Wang (1994)
F.G. Yost, F.M. Hosking, and D.R. Frear, The Mechanics of Solder Alloy Wetting and Spreading (New York: Van Nostrand Reinhold, 1993). / The Mechanics of Solder Alloy Wetting and Spreading by F.G. Yost (1993)
H.K. Kim, H.K. Liou, and K.N. Tu, J. Mater. Res. 10, 497 (1985). (10.1557/JMR.1995.0497) / J. Mater. Res. by H.K. Kim (1985)
F.G. Yost and A.D. Romig, Jr., Mater. Res. Soc. Symp. Proc. 108, 385 (1988). (10.1557/PROC-108-385) / Mater. Res. Soc. Symp. Proc. by F.G. Yost (1988)

Dates

Type	When
Created	18 years, 4 months ago (April 10, 2007, 5:13 a.m.)
Deposited	3 years, 3 months ago (May 15, 2022, 3:30 a.m.)
Indexed	2 weeks ago (Aug. 6, 2025, 9:53 a.m.)
Issued	25 years, 4 months ago (April 1, 2000)
Published	25 years, 4 months ago (April 1, 2000)
Published Print	25 years, 4 months ago (April 1, 2000)

Funders 0

None

BibTeX

@article{Liu_2000, title={Interfacial reactions between liquid indium and Au-deposited substrates}, volume={29}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/s11664-000-0152-y}, DOI={10.1007/s11664-000-0152-y}, number={4}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Liu, Y. M. and Chuang, T. H.}, year={2000}, month=apr, pages={405–410} }

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