DOI: 10.1007/s11661-005-0138-8. Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

10.1007/s11661-005-0138-8

Crossref journal-article

Springer Science and Business Media LLC

Metallurgical and Materials Transactions A (297)

Bibliography

Deng, X., Sidhu, R. S., Johnson, P., & Chawla, N. (2005). Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints. Metallurgical and Materials Transactions A, 36(1), 55â64.

Authors 4

X. Deng (first)
R. S. Sidhu (additional)
P. Johnson (additional)
N. Chawla (additional)

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Dates

Type	When
Created	18 years, 4 months ago (April 6, 2007, 1:56 p.m.)
Deposited	2 years, 3 months ago (May 17, 2023, 10:21 a.m.)
Indexed	1 month, 2 weeks ago (July 9, 2025, 7 p.m.)
Issued	20 years, 7 months ago (Jan. 1, 2005)
Published	20 years, 7 months ago (Jan. 1, 2005)
Published Print	20 years, 7 months ago (Jan. 1, 2005)

Funders 0

None

BibTeX

@article{Deng_2005, title={Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints}, volume={36}, ISSN={1543-1940}, url={http://dx.doi.org/10.1007/s11661-005-0138-8}, DOI={10.1007/s11661-005-0138-8}, number={1}, journal={Metallurgical and Materials Transactions A}, publisher={Springer Science and Business Media LLC}, author={Deng, X. and Sidhu, R. S. and Johnson, P. and Chawla, N.}, year={2005}, month=jan, pages={55–64} }

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