DOI: 10.1007/s00170-011-3289-3. Study on tool wear characteristics in diamond turning of reaction-bonded silicon carbide

Study on tool wear characteristics in diamond turning of reaction-bonded silicon carbide

10.1007/s00170-011-3289-3

Crossref journal-article

Springer Science and Business Media LLC

The International Journal of Advanced Manufacturing Technology (297)

Bibliography

Zhang, Z., Yan, J., & Kuriyagawa, T. (2011). Study on tool wear characteristics in diamond turning of reaction-bonded silicon carbide. The International Journal of Advanced Manufacturing Technology, 57(1â4), 117â125.

Authors 3

Zhiyu Zhang (first)
Jiwang Yan (additional)
Tsunemoto Kuriyagawa (additional)

References 19 Referenced 48

Hall C, Tricard M, Murakoshi H, Yamamoto Y, Kuriyama K, Yoko H (2005) New mold manufacturing techniques. Proc SPIE 5868:58680V (10.1117/12.621097) / Proc. SPIE by C Hall (2005)
Toshiya H, Ichiro I, Junichi S (1985) Grinding of silicon carbide with diamond wheel, T. Jpn Soc Mech Eng C 51:1864–1870 (10.1299/kikaia.51.1864) / Jpn. Soc. Mech. Eng. C by H Toshiya (1985)
Dai Y, Ohmori H, Lin W, Eto H, Ebizuka N, Tsuno K (2005) ELID grinding properties of high-strength reaction-sintered SiC. Key Eng Mater 291–292:121–126 (10.4028/www.scientific.net/KEM.291-292.121) / Key Eng Mater by Y Dai (2005)
Tam HY, Cheng HB, Wang YW (2007) Removal rate and surface roughness in the lapping and polishing of RB-SiC optical components. J Mater Process Tech 192–193:276–280 (10.1016/j.jmatprotec.2007.04.091) / J Mater Process Tech by HY Tam (2007)
Cheng H, Feng Z, Lei S, Wang Y (2005) Magnetorheological finishing of SiC aspheric mirrors. Mater Manuf Process 20:917–931 (10.1081/AMP-200060417) / Mater Manuf Process by H Cheng (2005)
Yan J, Oowada T, Zhou T, Kuriyagawa T (2009) Precision machining of microstructures on electroless-plated NiP surface for molding glass components. J Mater Process Tech 209:4802–4808 (10.1016/j.jmatprotec.2008.12.008) / J Mater Process Tech by J Yan (2009)
Samant A, Dahotre N (2009) Laser machining of structural ceramics. J Eur Ceram Soc 29:969–993 (10.1016/j.jeurceramsoc.2008.11.010) / J Eur Ceram Soc by A Samant (2009)
Wesch W, Heft A, Menzel R, Bachmann T, Peiter G, Hobert H, Höche T, Dannberg P, Bräuer A (1999) Ion beam processing of SiC for optical application. Nucl Instrum Meth B 148:545–550 (10.1016/S0168-583X(98)00826-X) / Nucl. Instrum. Meth. B by W Wesch (1999)
Yan J, Zhang Z, Kuriyagawa T (2009) Mechanism for material removal in diamond turning of reaction-bonded silicon carbide. Int J Mach Tools Manuf 49:366–374 (10.1016/j.ijmachtools.2008.12.007) / Int J Mach Tools Manuf by J Yan (2009)
Patten JA, Gao W, Yasuto K (2005) Ductile regime nanomachining of single-crystal silicon carbide. J Manuf Sci E-T ASME 127:522–532 (10.1115/1.1949614) / J. Manuf. Sci. E-T ASME by JA Patten (2005)
Suyama S, Kameda T, Itoh Y (2003) Development of high-strength reaction-sintered silicon carbide. Diam Relat Mater 12:1201–1204 (10.1016/S0925-9635(03)00066-9) / Diam. Relat. Mater by S Suyama (2003)
Ohta T, Yan J, Kodera S, Yajima S, Horikawa N, Takahashi Y, Kuriyagawa T (2008) Coolant effects on tool wear in machining single-crystal silicon with diamond tools. Key Eng Mater 389–390:144–150 (10.4028/www.scientific.net/KEM.389-390.144) / Key Eng Mater by T Ohta (2008)
Gogotsi G, Kailer A, Nickel G (1999) Transformation of diamond to graphite. Nature 401:663–664 (10.1038/44323) / Nature by G Gogotsi (1999)
Yan J, Asami T, Harada H, Kuriyagawa T (2009) Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining. Prec Eng 33(4):378–386 (10.1016/j.precisioneng.2008.10.008) / Prec. Eng by J Yan (2009)
Vogelgesang R, Alvarenga AD, Kim H, Ramdas AK, Rodriguez S, Grimsditch M, Anthony TR (1998) Multiphonon Raman and infrared spectra of isotopically controlled diamond. Phys Rev B 58:5408–5416 (10.1103/PhysRevB.58.5408) / Phys Rev B by R Vogelgesang (1998)
Nazare MH, Neves AJ (2001) Properties, Growth and Applications of Diamond. INSPEC, IEE, London / Properties, Growth and Applications of Diamond by MH Nazare (2001)
Yan J, Syoji K, Tamaki J (2003) Some observations on the wear of diamond tools in ultraprecision cutting of single-crystal silicon. Wear 255(7–12):1380–1387 (10.1016/S0043-1648(03)00076-0) / Wear by J Yan (2003)
Cai MB, Li XP, Rahman M (2007) Characteristics of “dynamic hard particles” in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear. Wear 263:1459–1466 (10.1016/j.wear.2006.11.030) / Wear by MB Cai (2007)
Zong WJ, Sun T, Li D, Cheng K, Liang YC (2008) XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer. Int J Mach Tools Manuf 48:1678–1687 (10.1016/j.ijmachtools.2008.06.008) / Int J Mach Tools Manuf by WJ Zong (2008)

Dates

Type	When
Created	14 years, 4 months ago (April 12, 2011, 6:22 a.m.)
Deposited	2 years, 2 months ago (June 6, 2023, 3:47 a.m.)
Indexed	1 month, 2 weeks ago (July 16, 2025, 9:01 a.m.)
Issued	14 years, 4 months ago (April 13, 2011)
Published	14 years, 4 months ago (April 13, 2011)
Published Online	14 years, 4 months ago (April 13, 2011)
Published Print	13 years, 10 months ago (Nov. 1, 2011)

Funders 0

None

BibTeX

@article{Zhang_2011, title={Study on tool wear characteristics in diamond turning of reaction-bonded silicon carbide}, volume={57}, ISSN={1433-3015}, url={http://dx.doi.org/10.1007/s00170-011-3289-3}, DOI={10.1007/s00170-011-3289-3}, number={1–4}, journal={The International Journal of Advanced Manufacturing Technology}, publisher={Springer Science and Business Media LLC}, author={Zhang, Zhiyu and Yan, Jiwang and Kuriyagawa, Tsunemoto}, year={2011}, month=apr, pages={117–125} }

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