DOI: 10.1007/bf02673337. Mechanical properties and microstructural characterization of Al-0.5%Cu thin films

Mechanical properties and microstructural characterization of Al-0.5%Cu thin films

10.1007/bf02673337

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Venkatraman, R., Bravman, J. C., Nix, W. D., Avies, P. W. D., Flinn, P. A., & Fraser, D. B. (1990). Mechanical properties and microstructural characterization of Al-0.5%Cu thin films. Journal of Electronic Materials, 19(11), 1231â1237.

Authors 6

Ramnath Venkatraman (first)
John C. Bravman (additional)
W. D. Nix (additional)
Paul W. D Avies (additional)
Paul A. Flinn (additional)
David B. Fraser (additional)

References 14 Referenced 102

S. Mayumi, T. Umemoto, M. Shishino, H. Nanatsue, S. Ueda and M. Inque, Proc. Int. Rel. Phys. Symp. 15 (1987). (10.1109/IRPS.1987.362149)
W. Y. Lee, J. M. Eldridge and G. C. Schultz, J. Appl. Phys. 52, 2994 (1981). (10.1063/1.329043) / J. Appl. Phys. by W. Y. Lee (1981)
T. S. Kuan and M. Murakami, Met. Trans.13A, 383 (1982). (10.1007/BF02643347) / Met. Trans. by T. S. Kuan (1982)
P. A. Flinn and G. A. Waychunas, J. Vac. Sci. Technol.B6, 1749 (1988). (10.1116/1.584172) / J. Vac. Sci. Technol. by P. A. Flinn (1988)
P. A. Flinn, D. S. Gardner and W. D. Nix, IEEE Trans. Electron DevicesED-34, 689 (1987). (10.1109/T-ED.1987.22981) / IEEE Trans. Electron Devices by P. A. Flinn (1987)
L. B. Freund, J. Appl. Mech.54, 553 (1987). (10.1115/1.3173068) / J. Appl. Mech. by L. B. Freund (1987)
M. Murakami, Thin Solid Films69, 253 (1980). (10.1016/0040-6090(80)90042-5) / Thin Solid Films by M. Murakami (1980)
A. J. Griffin,Jr., F. R. Brotzen and C. Dunn, Scripta Metall.20, 1271 (1986). (10.1016/0036-9748(86)90046-3) / Scripta Metall by A. J. Griffin (1986)
M. F. Doerner, D. S. Gardner and W. D. Nix, J. Mater. Res.1, 845 (1986). (10.1557/JMR.1986.0845) / J. Mater. Res. by M. F. Doerner (1986)
P. Chaudhari, J. Vac. Sci. Technol.9, 520 (1972). (10.1116/1.1316674) / J. Vac. Sci. Technol. by P. Chaudhari (1972)
D. Turnbull, Trans. AIME191, 161 (1951). / Trans. AIME by D. Turnbull (1951)
D. S. Gardner, Ph.D. dissertation, Stanford University (1987).
P. H. Townsend, Ph.D. dissertation, Stanford University (1988).
A. D. Romig, D. R. Frear and T. J. Headley, Proc. 47th Ann. Meeting Electron Microscopy Soc. Am. 216 (1989). (10.1017/S0424820100153051)

Dates

Type	When
Created	18 years, 1 month ago (July 16, 2007, 4:34 p.m.)
Deposited	7 months ago (Jan. 19, 2025, 8:12 a.m.)
Indexed	7 months ago (Jan. 19, 2025, 8:40 a.m.)
Issued	34 years, 9 months ago (Nov. 1, 1990)
Published	34 years, 9 months ago (Nov. 1, 1990)
Published Print	34 years, 9 months ago (Nov. 1, 1990)

Funders 0

None

BibTeX

@article{Venkatraman_1990, title={Mechanical properties and microstructural characterization of Al-0.5%Cu thin films}, volume={19}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/bf02673337}, DOI={10.1007/bf02673337}, number={11}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Venkatraman, Ramnath and Bravman, John C. and Nix, W. D. and Avies, Paul W. D and Flinn, Paul A. and Fraser, David B.}, year={1990}, month=nov, pages={1231–1237} }

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