DOI: 10.1007/bf02666403. Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin films

Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin films

10.1007/bf02666403

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Campbell, A. N., Mikawa, R. E., & Knorr, D. B. (1993). Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin films. Journal of Electronic Materials, 22(6), 589â596.

Authors 3

Ann N. Campbell (first)
Russell E. Mikawa (additional)
David B. Knorr (additional)

References 21 Referenced 37

T. Kwok and P.S. Ho, inDiffusion Phenomena in Thin Films and Microelectronic Materials, eds. D. Gupta and P.S. Ho (Noyes, Park Ridge, NJ, 1988), 369–431. / Diffusion Phenomena in Thin Films and Microelectronic Materials by T. Kwok (1988)
S. Vaidya, D.B. Fraser and A.K. Sinha,Proc. 18th Int. Reliability Phys. Symp., 165 (1980). (10.1109/IRPS.1980.362934)
S. Vaidya and A.K. Sinha,Thin Solid Films 75, 253 (1981). (10.1016/0040-6090(81)90404-1) / Thin Solid Films by S. Vaidya (1981)
M.J. Attardo and R. Rosenberg,J. Appl. Phys. 41,2381 (1970). (10.1063/1.1659233) / J. Appl. Phys. by M.J. Attardo (1970)
J. Cho and C.V. Thompson,App. Phys. Lett. 54, 2577 (1989). (10.1063/1.101054) / App. Phys. Lett. by J. Cho (1989)
J. Cho and C.V. Thompson,J. Electron. Mater. 19, 1207 (1990). (10.1007/BF02673334) / J. Electron. Mater. by J. Cho (1990)
D.B. Knorr, D.P. Tracy and K.P. Rodbell,Appl. Phys. Lett. 59, 3241 (1991). (10.1063/1.105745) / Appl. Phys. Lett. by D.B. Knorr (1991)
D.B. Knorr and K.P. Rodbell inSubmicron Metallization: The Challenges, Opportunities, and Limitations (SPIE, Redmond, WA, 1993), to be published. / Submicron Metallization: The Challenges, Opportunities, and Limitations by D.B. Knorr (1993)
I. Kaur, W. Gust and L. Kozma,Handbook of Grain and Interphase Boundary Division Data, Vol. I and II (Ziegler Press, Stuttgart, Germany, 1989). / Handbook of Grain and Interphase Boundary Division Data by I. Kaur (1989)
D.B. Knorr, D.P. Tracy and T.-M. Lu,MAS Proc. Vol. 202, Mater. Res. Soc, Pittsburgh, PA, 199–204 (1991). / MAS Proc. by D.B. Knorr (1991)
H.J. Bunge and K.-H. Puch,Z. Metallke. 75, 124 (1984). / Z. Metallke. by H.J. Bunge (1984)
H.J. Bunge,Quantitative Texture Analysis, eds. H.J. Bunge and C. Esling (DGM, Oberursel, Germany, 1982), 82–128. / Quantitative Texture Analysis by H.J. Bunge (1982)
E. Kinsbron,Appl. Phys. Lett. 36, 968 (1980). (10.1063/1.91385) / Appl. Phys. Lett. by E. Kinsbron (1980)
S. Vaidya, T.T. Sheng and A.K. Sinha,Appl. Phys. Lett. 36, 464 (1980). (10.1063/1.91508) / Appl. Phys. Lett. by S. Vaidya (1980)
D. Pramanik and J. Glanville,Solid State Technology 33, 77 (1990). / Solid State Technology by D. Pramanik (1990)
H.A. Schafft,IEEE Trans. Electron Devices ED-34, 664 (1987). (10.1109/T-ED.1987.22978) / IEEE Trans. Electron Devices by H.A. Schafft (1987)
E. Menzel and E. Kubalek,Scanning 5, 103 (1983). (10.1002/sca.4950050301) / Scanning by E. Menzel (1983)
L.G. Schulz,J. Appl. Phys. 20, 1030 (1949). (10.1063/1.1698268) / J. Appl. Phys. by L.G. Schulz (1949)
W.P. Chernock and P.A. Beck,J. Appl. Phys. 23, 341 (1952). (10.1063/1.1702204) / J. Appl. Phys. by W.P. Chernock (1952)
S.K. Kurtz, S. Levinson and D. Shi,J. Amer. Ceram. Soc. 72, 2223 (1989). (10.1111/j.1151-2916.1989.tb06066.x) / J. Amer. Ceram. Soc. by S.K. Kurtz (1989)
D.S. Peck and O.D. Trapp,Accelerated Testing Handbook, Ch. 6, Technology Assoc, Portola Valley, CA, 1987. / Accelerated Testing Handbook by D.S. Peck (1987)

Dates

Type	When
Created	18 years, 1 month ago (July 16, 2007, 5:56 p.m.)
Deposited	7 months ago (Jan. 19, 2025, 8:37 a.m.)
Indexed	7 months ago (Jan. 19, 2025, 9:10 a.m.)
Issued	32 years, 2 months ago (June 1, 1993)
Published	32 years, 2 months ago (June 1, 1993)
Published Print	32 years, 2 months ago (June 1, 1993)

Funders 0

None

BibTeX

@article{Campbell_1993, title={Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin films}, volume={22}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/bf02666403}, DOI={10.1007/bf02666403}, number={6}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Campbell, Ann N. and Mikawa, Russell E. and Knorr, David B.}, year={1993}, month=jun, pages={589–596} }

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