DOI: 10.1007/bf02655465. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints

The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints

10.1007/bf02655465

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Yang, W., Felton, L. E., & Messler, R. W. (1995). The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints. Journal of Electronic Materials, 24(10), 1465â1472.

Authors 3

Wenge Yang (first)
Lawrence E. Felton (additional)
Robert W. Messler (additional)

References 24 Referenced 136

S. Jin,JOM 45, 13 (1993). (10.1007/BF03222373) / JOM by S. Jin (1993)
L.E. Felton, C.H. Raeder, D.B. Knorr and C.H. Havasy,Proc. 1992 Intl. Electronics Manu. Symp. (1992), p. 300.
C. Melton,Proc. 1993 IEEE Intl. Symp. Electronics and the Environment, (1993), p. 94. (10.1109/ISEE.1993.302830)
W.L. Winterbottom,JOM 45, 20 (1993). (10.1007/BF03222375) / JOM by W.L. Winterbottom (1993)
W.J. Tomlinson and A. Fullylove,J. Mater. Sci. 27, 5777 (1992). (10.1007/BF01119737) / J. Mater. Sci. by W.J. Tomlinson (1992)
S.K. Kang and A.K. Sarkhel,J. Electron. Mater. 23, 701 (1994). (10.1007/BF02651362) / J. Electron. Mater. by S.K. Kang and A.K. Sarkhel (1994)
J.S. Hwang and R.M. Vargas,Soldering & Surface Mount Techn. 5,38(1990). (10.1108/eb037718) / Soldering & Surface Mount Techn. by J.S. Hwang (1990)
M. Harada and R. Satoh,IEEE/CHMT 13, 736 (1990). / IEEE/CHMT by M. Harada (1990)
J. Beuers and G. Ptashek,Proc. IEEE/ISHM’92 Symp. (1992), p. 120.
D. Shangguan and A. Achari,Proc. 16th IEEE/CPMT Intl. Electronics Manu. Technology Symp. (1994), p. 25. (10.1109/IEMT.1994.404695)
W. Yang, L.E. Felton and R.W. MessIer, Jr.,J. Electron. Mater. 23, 765 (1994). (10.1007/BF02651371) / J. Electron. Mater. by W. Yang (1994)
W. Yang, L.E. Felton and R.W. Messlier, Jr.,Proc. Conf. Advanced Joining Technologies for New Materials II, (1994).
M. McCormack, S. Jin and G.W. Kammlott,Appl. Phys. Lett. 64, 580 (1994). (10.1063/1.111114) / Appl. Phys. Lett. by M. McCormack (1994)
F. Dirnfeld and J.J. Ramon,Welding Journal 69, 373s (1990). / Welding Journal by F. Dirnfeld (1990)
M. Nylen and S. Norgren,Soldering & Surface Mount Technology, 5 15 (1990). (10.1108/eb037714) / Soldering & Surface Mount Technology by M. Nylen (1990)
Z. Mei, J.W. Morris, Jr., M.C. Shine and T.S.E. Summers,J. Electron. Mater. 20, 599 (1991). (10.1007/BF02669524) / J. Electron. Mater. by Z. Mei (1991)
D. Frear, D. Grivas and J.W. Morris, Jr.,J. Electron. Mater. 16, 181 (1987). (10.1007/BF02655484) / J. Electron. Mater. by D. Frear (1987)
D. Frear, F.M. Hosking and P.T. Vianco,Proc. Materials Developments in Microelectronic Packaging Conf. (1991), p. 229.
L.E. Felton, K. Rajan, P.J. Ficalora and P. Singh,Proc. Materials Developments in Microelectronic Packaging Conf. (1991), p. 23.
W.G. Bader,Welding Journal 54, 370s (1975). / Welding Journal by W.G. Bader (1975)
K. Fisher,Fundamentals of Solidification (Aedennannsdorf, Switzerland: Tech Trans Publications, 1986). / Fundamentals of Solidification by K. Fisher (1986)
R.E. Reed-Hill,Physical Metallurgy Principles, Ed., (Boston: PWS-Kent Publishing Company, 1992). / Physical Metallurgy Principles by R.E. Reed-Hill (1992)
A.J. Sunwoo, J.W.MorrisJr. and G.K Lucey, Jr.,Metall. Trans. A, 23A, 1323(1992). (10.1007/BF02665064) / Metall. Trans. A by A.J. Sunwoo (1992)
E.K. Ohriner,Welding Journal 66, 191s (1987). / Welding Journal by E.K. Ohriner (1987)

Dates

Type	When
Created	18 years, 1 month ago (July 16, 2007, 3:47 p.m.)
Deposited	6 years, 3 months ago (May 20, 2019, 2:08 a.m.)
Indexed	2 months ago (June 24, 2025, 7:43 a.m.)
Issued	29 years, 10 months ago (Oct. 1, 1995)
Published	29 years, 10 months ago (Oct. 1, 1995)
Published Print	29 years, 10 months ago (Oct. 1, 1995)

Funders 0

None

BibTeX

@article{Yang_1995, title={The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints}, volume={24}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/bf02655465}, DOI={10.1007/bf02655465}, number={10}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Yang, Wenge and Felton, Lawrence E. and Messler, Robert W.}, year={1995}, month=oct, pages={1465–1472} }

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