DOI: 10.1007/bf02652963. Through-thickness characterization of copper electrodeposit

Through-thickness characterization of copper electrodeposit

10.1007/bf02652963

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

De Angelis, R. J., Knorr, D. B., & Merchant, H. D. (1995). Through-thickness characterization of copper electrodeposit. Journal of Electronic Materials, 24(8).

Authors 3

R. J. De Angelis (first)
D. B. Knorr (additional)
H. D. Merchant (additional)

References 31 Referenced 20

L.S. Palatnik and A.I. Il’inskii,Soviet Phys. Uspekhi 11, 564 (1969). (10.1070/PU1969v011n04ABEH003768) / Soviet Phys. Uspekhi by L.S. Palatnik (1969)
I.T. Aleksanyan, L.A. Tumanova and T.D. Shemargor,Phys. Met. Metall. 34 (3), 200 (1972). / Phys. Met. Metall. by I.T. Aleksanyan (1972)
N.A. Pangarov, S.D. Vitkova and I. Vzunova,Electrochim. Acta 11, 1747(1966). (10.1016/0013-4686(66)80087-7) / Electrochim. Acta by N.A. Pangarov (1966)
N. Atanassov, S. Vitkova and S. Rashkov,Surf. Tech. 13,215 (1981). (10.1016/0376-4583(81)90120-5) / Surf. Tech. by N. Atanassov (1981)
I. Tomav,Mats. Sci. Forum 133–136, 175 (1993). (10.4028/www.scientific.net/MSF.133-136.175) / Mats. Sci. Forum by I. Tomav (1993)
J. Bebczuk de Cusminsky,J. Cryst. Growth 41, 330 (1977). (10.1016/0022-0248(77)90065-3) / J. Cryst. Growth by J. Bebczuk de Cusminsky (1977)
H.D. Merchant,J. Electron. Mater. 22, 631 (1993). (10.1007/BF02666409) / J. Electron. Mater. by H.D. Merchant (1993)
L. G. Shultz,J. Appl. Phys. 20, 1030 (1949). (10.1063/1.1698268) / J. Appl. Phys. by L. G. Shultz (1949)
R. Junginger and G. Eisner,J. Electroch. Soc. 135, 2305 (1988). / J. Electroch. Soc. by R. Junginger (1988)
E.M. Hofer and H.E. Hintermann,J. Electroch. Soc. 112,165 (1965). / J. Electroch. Soc. by E.M. Hofer (1965)
D.E. Warren,X-ray Diffraction, (Reading, MA: Addison Wesley, 1969), p. 251. / X-ray Diffraction by D.E. Warren (1969)
D.B. Knorr, D.P. Tracy and T.M. Lu,Textures and Micro-structures 14–18, 543 (1991). (10.1155/TSM.14-18.543) / Textures and Micro-structures by D.B. Knorr (1991)
W.P. Chernock and P.A. Beck,J. Appl. Phys. 23, 341 (1952). (10.1063/1.1702204) / J. Appl. Phys. by W.P. Chernock (1952)
H.P. Klug and L.E. Alexander,X-Ray Diffraction Procedures, (New York: John Wiley, 1954). / X-Ray Diffraction Procedures by H.P. Klug (1954)
D.B. Knorr,Mater. Res. Soc. Proc. 309, 75 (1993). (10.1557/PROC-309-75) / Mater. Res. Soc. Proc. by D.B. Knorr (1993)
P. Ganesan, H.K. Kuo and R.J. DeAngelis,J. Catalysis 55, 310 (1978). (10.1016/0021-9517(78)90145-8) / J. Catalysis by P. Ganesan (1978)
O.B. Girin, V.P. Khlyntsev and G.M. Vorobev,Russ. Met. (4) 172 (1988).
O.B. Girin,Russ. Met. (4) 130 (1990);Indus. Lab. 49, 55 (1983).
K. Lin and K.G. Sheppard,Plating Surf. Fin. 80, 40 (Aug. 1993). / Plating Surf. Fin. by K. Lin (1993)
T..Chen and P. Cavalotti,IEEE Trans. Magn. 18,1125(1982). (10.1109/TMAG.1982.1062217) / IEEE Trans. Magn. by T. .Chen (1982)
Y. Maeda,Jpn. J. Appl. Phys. Part 2, 24, L951 (1985). (10.1143/JJAP.24.L951) / Jpn. J. Appl. Phys. by Y. Maeda (1985)
N. Atanassov, S. Vitkova and S. Rashkov,Surf. Tech. 13,215 (1981). (10.1016/0376-4583(81)90120-5) / Surf. Tech. by N. Atanassov (1981)
C. Schmidt,Galvanotechnik 82, 3800 (1991). / Galvanotechnik by C. Schmidt (1991)
E.A. Mamontov, L.A. Kurzbatova and A.P. Volenko,Soviet Electroch. 22, 589 (1986). / Soviet Electroch. by E.A. Mamontov (1986)
O.B. Girin and V.R. Khlyntsev,Russ. Met. (6) 151 (1990).
M. Froment and G. Maurin,J. Microsc. Spectrosc. Electron. 12, 379 (1987). / J. Microsc. Spectrosc. Electron. by M. Froment (1987)
B. Grushko and G.R. Stafford,Scripta Metall. 23, 557, 1043 (1989);Metall. Trans. 20A, 1351 (1989); 21A, 2869 (1990). (10.1016/0036-9748(89)90451-1) / Scripta Metall. by B. Grushko (1989)
V.G. Shadrow, A.V. Boltushkin and T.A. Tochitskit,Russ. Met. (4) 61 (1990). (10.1016/0040-6090(91)90541-5)
V.V. Gubin et al.,Soviet Electroch. 20, 671 (1984). / Soviet Electroch. by V.V. Gubin (1984)
K. Farrel and J.T. Houston,Metall. Trans, 1, 1979 (1970). (10.1007/BF02642798) / Metall. Trans by K. Farrel (1970)
S. Nakahara and Y. Okinaka,Annu. Rev. Mater. Sci. 21, 93 (1993). (10.1146/annurev.ms.21.080191.000521) / Annu. Rev. Mater. Sci. by S. Nakahara (1993)

Dates

Type	When
Created	18 years, 1 month ago (July 6, 2007, 4:01 a.m.)
Deposited	3 years, 3 months ago (May 15, 2022, 11:42 a.m.)
Indexed	1 month, 4 weeks ago (June 24, 2025, 7:29 a.m.)
Issued	30 years ago (Aug. 1, 1995)
Published	30 years ago (Aug. 1, 1995)
Published Print	30 years ago (Aug. 1, 1995)

Funders 0

None

BibTeX

@article{De_Angelis_1995, title={Through-thickness characterization of copper electrodeposit}, volume={24}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/bf02652963}, DOI={10.1007/bf02652963}, number={8}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={De Angelis, R. J. and Knorr, D. B. and Merchant, H. D.}, year={1995}, month=aug }

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