DOI: 10.1007/bf02652148. A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints

A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints

10.1007/bf02652148

Crossref journal-article

Springer Science and Business Media LLC

Journal of Electronic Materials (297)

Bibliography

Frear, D., Grivas, D., & Morris, J. W. (1988). A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints. Journal of Electronic Materials, 17(2), 171â180.

Authors 3

D. Frear (first)
D. Grivas (additional)
J. W. Morris (additional)

References 29 Referenced 125

E. Levine and J. Ordenez, IEEE Trans Components, Hybrids, and Manufacturing Tech.CHMT-4, 515 (1981). (10.1109/TCHMT.1981.1135845) / IEEE Trans Components, Hybrids, and Manufacturing Tech. by E. Levine (1981)
S. K. Rang, N. D. Zommer, D. L. Feucht, and R. W. Heckel, IEEE Trans Parts, Hybrids, and PackagingPHP-13, 318 (1977). / IEEE Trans Parts, Hybrids, and Packaging by S. K. Rang (1977)
J. T. Lynch, M. R. Ford, and A. Boetti; IEEE Trans Components, Hybrids, and Manufacturing Tech.CHMT-6, 237 (1983). (10.1109/TCHMT.1983.1136184) / IEEE Trans Components, Hybrids, and Manufacturing Tech. by J. T. Lynch (1983)
J. W. Munford, IEEE Trans Parts, Hybrids, and PackagingPHP-11, 296 (1975). (10.1109/TPHP.1975.1135080) / IEEE Trans Parts, Hybrids, and Packaging by J. W. Munford (1975)
R. N. Wild; “Fatigue properties of solder joints”, Welding Research Supp.51, 521s (1972). / Welding Research Supp. by R. N. Wild (1972)
E. A. Wright and W. M. Wolverton; “The effect of the solder reflow method and joint design on the thermal fatigue life of leadless chip carrier solder joints”, Proc. 34th Electron. Components Conf.,34, 149 (1984). / Proc. 34th Electron. Components Conf. by E. A. Wright (1984)
R. Yenawine, M. Wolverton, A. Burkett, B. Waller, B. Russel and D. Spritz; “Today and Tomorrow in Soldering”, Proc 11th Naval Weapons Electronics Manufacturing Seminar, China Lake, CA (1987) p. 339.
H. B. Ellis; “Aspects of surface mounted chip carrier solder joint reliability”, Proc. 11th Naval Weapons Electronics Manufacturing Seminar, China Lake, CA (1987) p. 377.
D. R. Olsen and A. M. Berg, IEEE Trans Components, Hybrids, and Manufacturing Tech.CHMT-2, 257 (1979). (10.1109/TCHMT.1979.1135450) / IEEE Trans Components, Hybrids, and Manufacturing Tech. by D. R. Olsen (1979)
L. S. Goldmann, R. D. Herdzik, N. G. Koopman and V. C. Marcotte, IEEE Trans Parts, Hybrids, and PackagingPHP-13, 194 (1977). (10.1109/TPHP.1977.1135198) / IEEE Trans Parts, Hybrids, and Packaging by L. S. Goldmann (1977)
H. S. Rathore, R. C. Yih and A. R. Edenfeld, J. Testing and Evaluation1, 170 (1973). (10.1520/JTE10895J) / J. Testing and Evaluation by H. S. Rathore (1973)
E. R. Bangs and R. E. Beal, Welding Res. Suppl.54, 377s (1975). / Welding Res. Suppl. by E. R. Bangs (1975)
K. C. Norris and A. H. Landzberg, IBM J. Res. Dev.13, 266 (1969). (10.1147/rd.133.0266) / IBM J. Res. Dev. by K. C. Norris (1969)
G. Becker, “Testing and results related to the mechanical strength of solder joints”, IPC Fall meeting IPC-TP-288 (1979).
E. C. Kubik and T. P. L. Li, “Thermal shock and temperature cycling effects on solder joints of hermetic chip carriers mounted on thick films”, Microelectronics Center, Martin Marrietta Aerospace, Orlando, FL 32855.
P. M. Hall, T. D. Dudderar and J. F. Argyle, IEEE Trans Components, Hybrids, and Manufacturing Tech.CHMT-6, 544 (1983). (10.1109/TCHMT.1983.1136203) / IEEE Trans Components, Hybrids, and Manufacturing Tech. by P. M. Hall (1983)
D. Frear, D. Grivas, M. McCormack, D. Tribula, and J. W. Morris, Jr., “Fatigue and thermal fatigue of Pb-Sn solder joints”, Proc. Effects of Load and Thermal Histories on Mechanical Behavior Symp. AIME Spring Conf., Denver, CO (1987), in press.
D. Frear, D. Grivas, M. McCormack, D. Tribula, and J. W. Morris, Jr. “Fatigue and thermal fatigue testing of Pb-Sn solder joints”, Proc. 3rd Ann. Electronic Packaging and Corrosion in Microelectronics Conf.,3, 269 (1987). / Proc. 3rd Ann. Electronic Packaging and Corrosion in Microelectronics Conf. by D. Frear (1987)
H. N. Keller, IEEE Trans Components, Hybrids, and Manufacturing Tech.CHMT-4, 132 (1981). (10.1109/TCHMT.1981.1135767) / IEEE Trans Components, Hybrids, and Manufacturing Tech. by H. N. Keller (1981)
P. M. Hall, IEEE Trans Components, Hybrids, and Manufacturing Tech.CHMT-4, 403 (1981). (10.1109/TCHMT.1981.1135840) / IEEE Trans Components, Hybrids, and Manufacturing Tech. by P. M. Hall (1981)
K. R. Stone, R. Duckett, S. Muckett, and M. E. Warwick, Brazing and Soldering4, 20 (1983). / Brazing and Soldering by K. R. Stone (1983)
C. Wright, IEEE Trans Parts, Hybrids, and Packaging,PHP-13, 202 (1977). (10.1109/TPHP.1977.1135211) / IEEE Trans Parts, Hybrids, and Packaging by C. Wright (1977)
M. C. Denlinger and D. W. Becker, Welding Res. Supp.57, 202s (1978). / Welding Res. Supp. by M. C. Denlinger (1978)
R. N. Wild, “Some fatigue properties of solders and solder joints”, IBM Report no. 74Z000481, Oct. (1975).
J. T. Lynch, G. M. Dydon, M. R. Hepher and J. P. McCarthy, “Environmental assessment of ceramic chip carriers soldered-attached to thick film alumina substrates”, Proc. 32nd Elec. Comp. Conf.,32, 385 (1982). / Proc. 32nd Elec. Comp. Conf. by J. T. Lynch (1982)
W. T. Chen and C. W. Nelson, IBM J. Res. Dev.23,179 (1979). (10.1147/rd.232.0179) / IBM J. Res. Dev. by W. T. Chen (1979)
C. J. Thwaites and W. B. Hampshire, Welding Res. Supp.55, 323s (1976). / Welding Res. Supp. by C. J. Thwaites (1976)
D. Grivas,Deformation of Superplastic Alloys at Relatively Low Strain Rates, Ph.D. Thesis, University of California, and Berkeley (1978). (10.2172/5005896)
D. Frear, D. Grivas, L. Quan and J. W. Morris, Jr., “Micro-structural observations and mechanical behavior of Pb-Sn solder on Cu plates”, Mat. Res. Soc. Symp.,72, 181 (1986). (10.1557/PROC-72-181) / Mat. Res. Soc. Symp. by D. Frear (1986)

Dates

Type	When
Created	18 years, 1 month ago (July 6, 2007, 1:51 a.m.)
Deposited	3 years, 3 months ago (May 15, 2022, 11:35 a.m.)
Indexed	2 months, 1 week ago (June 25, 2025, 7:05 p.m.)
Issued	37 years, 6 months ago (March 1, 1988)
Published	37 years, 6 months ago (March 1, 1988)
Published Print	37 years, 6 months ago (March 1, 1988)

Funders 0

None

BibTeX

@article{Frear_1988, title={A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints}, volume={17}, ISSN={1543-186X}, url={http://dx.doi.org/10.1007/bf02652148}, DOI={10.1007/bf02652148}, number={2}, journal={Journal of Electronic Materials}, publisher={Springer Science and Business Media LLC}, author={Frear, D. and Grivas, D. and Morris, J. W.}, year={1988}, month=mar, pages={171–180} }

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