DOI: 10.1007/bf02628389. Isothermal fatigue of low tin lead based solder

Isothermal fatigue of low tin lead based solder

10.1007/bf02628389

Crossref journal-article

Springer Science and Business Media LLC

Metallurgical Transactions A (297)

Bibliography

Vayman, S., Fine, M. E., & Jeannotte, D. A. (1988). Isothermal fatigue of low tin lead based solder. Metallurgical Transactions A, 19(4), 1051â1059.

Authors 3

Semyon Vayman (first)
Morris E. Fine (additional)
Dexter A. Jeannotte (additional)

References 28 Referenced 47

J. H. Lau and D. W. Rice:Solid State Technology, 1985, vol. 28, no. 10. pp. 91–104. / Solid State Technology by J. H. Lau (1985)
J. F. Barges, R. O. Carlson, H. H. Glascock, C. A. Neugebauer, and H. F. Webster:IEEE CHMT-7, 1984, no. 4, pp. 405–10. / IEEE CHMT-7 by J. F. Barges (1984)
H. S. Rathore, R. C. Yih, and A. R. Edenfeld:J. Testing Evaluation, 1973, vol. 1, pp. 170–78. (10.1520/JTE10895J) / J. Testing Evaluation by H. S. Rathore (1973)
L. F. Coffin:Trans. ASME, 1954, vol. 76, pp. 931–50. / Trans. ASME by L. F. Coffin (1954)
S. S. Manson:Experimental Mechanics, 1965, vol. 5, no. 7, pp. 193–226. (10.1007/BF02321056) / Experimental Mechanics by S. S. Manson (1965)
K. C. Norris and A. H. Landzberg: IBM J. Res. Dev., May 1966, pp. 266–71.
J. F. Eckel:Proceedings ASTM, 1951, vol. 51, pp. 745–60. / Proceedings ASTM by J. F. Eckel (1951)
G. R. Gohn and W. C. Ellis:Proceedings ASTM, 1951, vol. 51, pp. 721–40. / Proceedings ASTM by G. R. Gohn (1951)
H. D. Solomon: Fatigue of 60/40 Solder, GE Technical Information Series, Class 1, May 1986. (10.1109/TCHMT.1986.1136672)
A. R. Ellozy, P. M. Dixon, and R. N. Wild: Proceedings of the Second International Conference on Mechanical Behavior of Materials, 1976, pp. 903–07.
H. J. Shah and J. H. Kelly: ISHM, 1970, pp. 3.4.1.–3.4.6.
B. N. Agarwala: 23rd Annual Proceedings, Reliability Physics, IEEE/IRPS, 1985, pp. 198–205. (10.1109/IRPS.1985.362098)
D. Turnbull:Acta Metall., 1955, vol. 3, pp. 55–63. (10.1016/0001-6160(55)90012-2) / Acta Metall. by D. Turnbull (1955)
K. N. Tu and D. Turnbull:Acta Metall., 1967, vol. 15, pp. 369–76. (10.1016/0001-6160(67)90214-3) / Acta Metall. by K. N. Tu (1967)
K. N. Tu and D. Turnbull:Acta Metall., 1967, vol. 15, pp. 1317–23. (10.1016/0001-6160(67)90007-7) / Acta Metall. by K. N. Tu (1967)
N.I. Afanas’ev and T. F. Yelsukova:Phys. Met. Metall., 1982, vol. 53, pp. 129–34. / Phys. Met. Metall. by N.I. Afanas’ev (1982)
Vander Voort:Metallography, Principles and Practice, McGraw-Hill Book Co., New York, NY, 1984, p. 581. (10.31399/asm.tb.mpp.9781627082600) / Metallography, Principles and Practice by Vander Voort (1984)
Y. L. Yousef:Philos. Mag., 1946, vol. 37, pp. 490–97. (10.1080/14786444608521532) / Philos. Mag. by Y. L. Yousef (1946)
L. Lawson:Review of Scientific Instruments, in press.
D. Raynor and R. P. Skelton:The Onset of Cracking and Failure Criteria in High Temperature Fatigue Testing, Elsevier Applied Science Publishers, London and New York, 1985, pp. 143–45. / The Onset of Cracking and Failure Criteria in High Temperature Fatigue Testing by D. Raynor (1985)
K. Bhanu Sankar Rao, M. Valsan, R. Sandhya, S. K. Ray, S. L. Mannan, and P. Rodriguez:Int. J. Fatigue, 1985, vol. 7, pp. 141–47. (10.1016/0142-1123(85)90024-6) / Int. J. Fatigue by K. Bhanu Sankar Rao (1985)
W. Hofmann:Lead and Lead Alloys, Springer-Verlag, New York, NY, 1970, pp. 95–100. (10.1007/978-3-662-28508-4) / Lead and Lead Alloys by W. Hofmann (1970)
M. Hansen:Constitution of Binary Alloys, McGraw-Hill Book Co., New York, NY, 1958, pp. 1106–08. / Constitution of Binary Alloys by M. Hansen (1958)
C.H. Wells and C. P. Sullivan: ASTM STP 459, ASTM, 1969, pp. 59–74.
P. R. Lavery: M.S. Thesis, Dartmouth College, Hanover, NH, 1987.
J. Wareing:Metall. Trans. A, 1977, vol. 8A, pp. 711–21. (10.1007/BF02664781) / Metall. Trans. A by J. Wareing (1977)
R. Berriche, S. Vaynman, M. E. Fine, and D. A. Jeannotte: Electronic Packaging and Corrosion in Microelectronics, Proc. of ASM’s Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, M. E. Nicholson, ed., ASM INTERNATIONAL, 1987, pp. 169–74.
J. K. Tien, S. V. Nair, and V. C. Nardone:Flow and Fracture at Elevated Temperatures, ASM, Metals Park, OH, 1985, pp. 179–214. / Flow and Fracture at Elevated Temperatures by J. K. Tien (1985)

Dates

Type	When
Created	18 years, 3 months ago (May 11, 2007, 9 a.m.)
Deposited	7 months, 2 weeks ago (Jan. 16, 2025, 12:35 a.m.)
Indexed	7 months, 1 week ago (Jan. 17, 2025, 12:09 a.m.)
Issued	37 years, 4 months ago (April 1, 1988)
Published	37 years, 4 months ago (April 1, 1988)
Published Print	37 years, 4 months ago (April 1, 1988)

Funders 0

None

BibTeX

@article{Vayman_1988, title={Isothermal fatigue of low tin lead based solder}, volume={19}, ISSN={2379-0180}, url={http://dx.doi.org/10.1007/bf02628389}, DOI={10.1007/bf02628389}, number={4}, journal={Metallurgical Transactions A}, publisher={Springer Science and Business Media LLC}, author={Vayman, Semyon and Fine, Morris E. and Jeannotte, Dexter A.}, year={1988}, month=apr, pages={1051–1059} }

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