DOI: 10.1007/0-387-23313-x_9. Practical Aspects of FIB Tem Specimen Preparation

Practical Aspects of FIB Tem Specimen Preparation

10.1007/0-387-23313-x_9

Crossref book-chapter

Springer US

Introduction to Focused Ion Beams (297)

Bibliography

Anderson, R., & Klepeis, S. J. (2005). Practical Aspects of FIB Tem Specimen Preparation. Introduction to Focused Ion Beams, 173â200.

Authors 2

Ron Anderson (first)
Stanley J. Klepeis (additional)

References 21 Referenced 12

Anderson RM and Klepeis SJ “Combined Tripod Polishing and FIB Methods for Preparing Semiconductor Plan View Specimens”. Specimen Preparation for Transmission Electron Microscopy of Materials IV, (eds.) R. Anderson, et. al., Materials Research Symposium Series 480, pp 187–192 (1997). (10.1557/PROC-480-187)
Anderson RM, et al., Microscopy of Semiconducting Materials 1989, Proceedings of the Physics Conference held at Oxford University, 10–13 April 1989, ed. by Cullis, A. G. and Hutchison J. L., Institute of Physics Conference Series Number 100, Bristol and New York (1989).
Anderson RM, et al., Proceedings EUREM 1996, Steer M. Cottrell D (eds.) p 79–80 (1992).
Anderson, RM, “Precision Ion Milling of Layered, Multi-Element TEM Specimens with High Specimen Preparation Spatial Resolution” In Specimen Preparation for Transmission Electron Microscopy of Materials-III, ed. Anderson, et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 141–148 (1992). (10.1557/PROC-254-141)
Anderson, RM, et al., Microbeam Analysis—1995, Proceedings of the 29th Annual Meeting of the Microbeam Analysis Society, ed. E. Etz, p. 135 (1995).
Basile D, et al. “FIBXTEM — Focussed Ion Beam Milling for TEM Sample preparation.” Specimen Preparation for Transmission Electron Microscopy of Materials III, (ed.) R. Anderson, Materials Research Symposium Series 254, pp 23–41 (1992). (10.1557/PROC-254-23)
Benedict JP, et al., “A Method for Precision Specimen Preparation for Both SEM and TEM Analysis.” EMSA Bulletin, 19,2, pp. 74–80 (ovember, 1989) / EMSA Bulletin by J. “. Benedict (1989)
Benedict JP, et al., “Recent Advances in E.M. Specimen Preparation: Cross-Section samples.” in International Symposium on Electron Microscopy, ed. by Kuo K and Yao J, World Scientific, p. 450–460 (1990a).
Benedict JP, et al., “Procedure for Cross Sectioning Specific Semiconductor Devices for both SEM and TEM Analysis.” In Specimen Preparation for Transmission Electron Microscopy of Materials-II, ed. Anderson, R., Mater. Res. Soc. Proc. 199, Pittsburgh, PA USA pp. 189–204 (1990b). (10.1557/PROC-199-189)
Benedict, JP, et al. “Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation.” In Specimen Preparation for Transmission Electron Microscopy of Materials-III, ed. Anderson et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 121–140 (1992). (10.1557/PROC-254-121)
Bravman JC, Sinclair R “The Preparation of Cross-section Specimens for Transmission Electron Microscopy.” J Electron Microsc Tech 1:53–61 (1984) (10.1002/jemt.1060010106) / J Electron Microsc Tech by J.C. Bravman (1984)
Hauffe W Thesis B, Technical University of Dresden, Dresden (1978)
Hauffe W Proc. 10th National Conference on Electron Microscopy, Phys. Sci. GDR, Leipzig, p. 307–308 (1981) / Proc. 10th National Conference on Electron Microscopy by W. Hauffe (1981)
Hauffe W, DDR Patentschrift DD218954 BL, 29 (September 982)
Hauffe W, “Ion Beam Microtome for Preparation of TEM Samples.” Proc EUREM 1984, 1, pp 105–106 (1984). / Proc EUREM 1984 by W. “. Hauffe (1984)
Kirk EC et al. “Cross-sectional transmission electron microscopy of precisely selected regions from semiconductor devices.” Inst. Phys. Conf. Series, 100, p 501–506 (1989) and numerous other references by many authors in the following years. / Inst. Phys. Conf. Series by E. “. Kirk (1989)
Klepeis SJ, et al., “A Grinding/Polishing Tool for TEM Sample preparation.” In Specimen Preparation for Transmission Electron Microscopy of Materials, ed. Bravman, et al., Mater. Res. Soc. Proc. 115, Pittsburgh, PA USA pp. 179–184 (1987). (10.1557/PROC-115-179)
Klepeis SJ, et al., “A Technique for Preparing Semiconductor Cross Sections for both TEM and SEM Analysis,” EMSA Proceedings, ed. by Bailey, G.W., San Francisco Press, p. 712–713 (1988). (10.1017/S0424820100155530)
Klepeis SJ, Proceedings of the 14th International Congress on Electron Microscopy, Vol III, Electron Microscopy 1998, p 541–542 (1998). / Electron Microscopy 1998 by S.J. Klepeis (1998)
Klepeis SJ, et al., “FIB Dimpling: A Method for Preparing Plan-View TEM Specimens,” EMSA Proceedings, ed. by Bailey, G.W., Springer-Verlag Press pp. 506–507 (2000).
Langford RM and Petford-Long AK “Broad ion beam milling of focused ion beam prepared transmission electron microscopy cross sections for high resolution electron microscopy,” J Vac Sci Technol A 19(3), p 982–985 (2001). (10.1116/1.1368198) / J Vac Sci Technol A by R.M. Langford (2001)

Dates

Type	When
Created	19 years, 3 months ago (May 17, 2006, 8:46 a.m.)
Deposited	4 years ago (July 27, 2021, 5:36 a.m.)
Indexed	3 weeks, 4 days ago (July 27, 2025, 3:31 a.m.)
Issued	20 years, 7 months ago (Jan. 1, 2005)
Published	20 years, 7 months ago (Jan. 1, 2005)
Published Print	20 years, 7 months ago (Jan. 1, 2005)

Funders 0

None

BibTeX

@inbook{Anderson_2005, title={Practical Aspects of FIB Tem Specimen Preparation: With Emphasis On Semiconductor Applications}, ISBN={9780387233130}, url={http://dx.doi.org/10.1007/0-387-23313-x_9}, DOI={10.1007/0-387-23313-x_9}, booktitle={Introduction to Focused Ion Beams}, publisher={Springer US}, author={Anderson, Ron and Klepeis, Stanley J.}, year={2005}, pages={173–200} }

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