10.1002/crat.2170210315
Crossref journal-article
Wiley
Crystal Research and Technology (311)
Abstract

AbstractPlasmachemical etching of Aluminium in chlorine containing discharges is discussed from a thermochemical point of view. A model of Al etching is proposed, in which diffusion of reaction products through the carbon‐rich deposite layer is considered to be rate‐limiting. The model quantitatively describes the dependence of the etch reaction on different process parameters of the CCl4‐plasma.

Bibliography

Sameith, D., Tiller, H. ‐J., & Breitbarth, F. ‐W. (1986). Dry Patterning of Al and Al Alloys. Crystal Research and Technology, 21(3), 407–412. Portico.

Authors 3
  1. D. Sameith (first)
  2. H.‐J. Tiller (additional)
  3. F.‐W. Breitbarth (additional)
References 13 Referenced 2
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Dates
Type When
Created 18 years, 7 months ago (Jan. 13, 2007, 7:49 a.m.)
Deposited 1 year, 10 months ago (Oct. 20, 2023, 6:40 p.m.)
Indexed 1 year, 10 months ago (Oct. 21, 2023, 7:13 a.m.)
Issued 39 years, 6 months ago (March 1, 1986)
Published 39 years, 6 months ago (March 1, 1986)
Published Online 19 years, 6 months ago (Feb. 19, 2006)
Published Print 39 years, 6 months ago (March 1, 1986)
Funders 0

None

@article{Sameith_1986, title={Dry Patterning of Al and Al Alloys}, volume={21}, ISSN={1521-4079}, url={http://dx.doi.org/10.1002/crat.2170210315}, DOI={10.1002/crat.2170210315}, number={3}, journal={Crystal Research and Technology}, publisher={Wiley}, author={Sameith, D. and Tiller, H.‐J. and Breitbarth, F.‐W.}, year={1986}, month=mar, pages={407–412} }