DOI: 10.1002/9780470314715.ch52. Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing

Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing

10.1002/9780470314715.ch52

Crossref book-chapter

John Wiley & Sons, Inc.

Ceramic Engineering and Science Proceedings (311)

Bibliography

Haggerty, J. S., & Lightfoot, A. (n.d.). Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing. Proceedings of the 19th Annual Conference on Composites, Advanced Ceramics, Materials, and StructuresâA: Ceramic Engineering and Science Proceedings, Volume 16, Issue 4, 475â487.

Authors 2

J. S. Haggerty (first)
A. Lightfoot (additional)

References 0 Referenced 112

None

Dates

Type	When
Created	17 years, 4 months ago (March 26, 2008, 1:33 p.m.)
Deposited	4 years, 1 month ago (June 29, 2021, 9 p.m.)
Indexed	4 days, 6 hours ago (Aug. 21, 2025, 1:40 p.m.)

Funders 0

None

BibTeX

@inbook{Haggerty, title={Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing}, ISSN={1940-6339}, url={http://dx.doi.org/10.1002/9780470314715.ch52}, DOI={10.1002/9780470314715.ch52}, booktitle={Proceedings of the 19th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures—A: Ceramic Engineering and Science Proceedings, Volume 16, Issue 4}, publisher={John Wiley & Sons, Inc.}, author={Haggerty, J. S. and Lightfoot, A.}, pages={475–487} }

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